Dislocation Punching From Ceramic/Metal Interfaces

[+] Author and Article Information
M. Taya

Department of Mechanical Engineering, Materials Science and Engineering, University of Washington, Seattle, WA 98195

T. Mori

Department of Materials Science and Engineering, Tokyo Institute of Technology, 2359 Nagatsuda, Midori-ku, Yokohama 227, Japan

J. Eng. Mater. Technol 116(3), 408-413 (Jul 01, 1994) (6 pages) doi:10.1115/1.2904306 History: Received August 24, 1993; Revised January 31, 1994; Online April 29, 2008


Relaxation of misfit strains at interfaces between two different materials by dislocation punching is studied analytically by focusing on two types of interfaces: planar and nonplanar. As an example of planar type interface, the case of metal coating/ ceramic substrate system is studied while ceramic filler/metal matrix composite system is examined as an example of a nonplanar interface. Based on the present analytical model, the condition for dislocation punching for each interface is established. Validity of the dislocation punching model is verified by comparing the analytical results with limited experimental results, resulting in a good agreement.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In