0
RESEARCH PAPERS

Fracture and Wear of Diamond Cutting Tools

[+] Author and Article Information
C. J. Wong

Xerox Corporation, Webster, N.Y. 14580

J. Eng. Mater. Technol 103(4), 341-345 (Oct 01, 1981) (5 pages) doi:10.1115/1.3225025 History: Received June 29, 1981; Online September 15, 2009

Abstract

This paper describes the performance of diamond cutting tools during high speed precision machining. Experimental data collected from a very large sample size showed that the tool life varied at random and was very close to exponential distribution. Tool wear can be characterized into normal wear, chipping, setting problems, line effects, chip dragging and fracture by inclusions in the workpiece. The tooling data showed that the effects of crystallographic orientations on tool life is insignificant. Experiments also indicated that tools with extremely short life have strong absorption band with maxima at 1365 cm−1 . This seems to show the existence of N-O bond in the diamond crystal lattices. The presence of N-O bond appears to be correlated to premature tool failure.

Copyright © 1981 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In