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RESEARCH PAPERS

Measurement of Residual Stresses Near the Surface Using the Crack Compliance Method

[+] Author and Article Information
W. Cheng, I. Finnie

Department of Mechanical Engineering, University of California, Berkeley, CA 94720

Ö. Vardar

Department of Mechanical Engineering, Bogazici University, Istanbul, 80815 Turkey

J. Eng. Mater. Technol 113(2), 199-204 (Apr 01, 1991) (6 pages) doi:10.1115/1.2903392 History: Received March 01, 1990; Revised May 05, 1990; Online April 29, 2008

Abstract

The use of thin cuts for residual stress measurement is referred to as the crack compliance method. A computational model is presented for the determination of normal and shear residual stresses near the surface by introducing shallow cuts. The optimum regions for strain measurement are obtained. This method is shown to be considerably more sensitive than the conventional hole drilling method and is capable of measuring residual stresses which vary with depth below the surface.

Copyright © 1991 by The American Society of Mechanical Engineers
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