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RESEARCH PAPERS: Additional Research Papers

Modeling of Viscoplastic Adhering Process by a Finite Element Technique

[+] Author and Article Information
Y. Takahashi

Welding Research Institute of Osaka University, Ibaraki 567, Japan

T. Koguchi, K. Nishiguchi

Department of Welding and Production, Osaka University, Suita 565, Japan

J. Eng. Mater. Technol 115(1), 150-155 (Jan 01, 1993) (6 pages) doi:10.1115/1.2902149 History: Received March 01, 1992; Revised August 25, 1992; Online April 29, 2008

Abstract

The intimate contacting of rough surfaces in the solid state bonding of metals is modeled by a finite element method. The finite element method can be applied to the large deformation process of rate sensitive materials. The material used is an oxygen free copper. We treat only the case that the intimate contact is the rate controlling step in the solid state adhering process which can be realized under high vacuum and high temperature conditions for copper at least. The intimate contacting process is assumed to be produced by viscoplastic deformation after the initial local contact is made by instantaneous plastic deformation. The calculated results are in good agreement with the experimental ones. The model can predict the interfacial deformation during the solid state bonding carried out under high pressure conditions.

Copyright © 1993 by The American Society of Mechanical Engineers
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