Effect of Bulk Deformation on Viscoplastic Adhering Process—A Numerical Study of Solid State Pressure Welding

[+] Author and Article Information
Y. Takahashi

Welding Research Institute of Osaka University, Ibaraki 567, Japan

T. Koguchi

Osaka University, Suita, 565, Japan

K. Nishiguchi

Department of Welding and Production, Osaka University, Suita, 565, Japan

J. Eng. Mater. Technol 115(2), 171-178 (Apr 01, 1993) (8 pages) doi:10.1115/1.2904203 History: Received March 01, 1992; Revised August 25, 1992; Online April 29, 2008


Viscoplastic intimate contact process of uneven surfaces is numerically studied by using the finite element model proposed in our previous paper. The model treats only the case that the interfacial contact is the rate determining step of the solid state bonding process. The distribution of the equivalent strain rate around the void surface is strongly influenced by the bulk constraint conditions, i.e., the interfacial deformation is greatly affected by the bulk deformation. The strain rate at the void tip is strikingly increased by the bulk deformation, which accelerates the void shrinkage on the bond interface. If the bulk is deformed, the contacting process is also affected by the asperity angle α0 due to surface waviness. When α0 < 30 deg, the bonded area growth is mainly produced by the folding phenomena of the faying surfaces.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In