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RESEARCH PAPERS

Dislocation Punching From Ceramic/Metal Interfaces

[+] Author and Article Information
M. Taya

Department of Mechanical Engineering, Materials Science and Engineering, University of Washington, Seattle, WA 98195

T. Mori

Department of Materials Science and Engineering, Tokyo Institute of Technology, 2359 Nagatsuda, Midori-ku, Yokohama 227, Japan

J. Eng. Mater. Technol 116(3), 408-413 (Jul 01, 1994) (6 pages) doi:10.1115/1.2904306 History: Received August 24, 1993; Revised January 31, 1994; Online April 29, 2008

Abstract

Relaxation of misfit strains at interfaces between two different materials by dislocation punching is studied analytically by focusing on two types of interfaces: planar and nonplanar. As an example of planar type interface, the case of metal coating/ ceramic substrate system is studied while ceramic filler/metal matrix composite system is examined as an example of a nonplanar interface. Based on the present analytical model, the condition for dislocation punching for each interface is established. Validity of the dislocation punching model is verified by comparing the analytical results with limited experimental results, resulting in a good agreement.

Copyright © 1994 by The American Society of Mechanical Engineers
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