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TECHNICAL PAPERS

Laminate Delamination Due to Thermal Gradients

[+] Author and Article Information
J. W. Hutchinson, T. J. Lu

Division of Applied Sciences, Harvard University, Cambridge, MA 02138

J. Eng. Mater. Technol 117(4), 386-390 (Oct 01, 1995) (5 pages) doi:10.1115/1.2804730 History: Received May 05, 1995; Online November 27, 2007

Abstract

Flaw-induced delamination of orthotropic laminates subject to through-thickness temperature gradients is analyzed. A crack-like flaw impedes heat flow through the laminate, producing thermal stresses and crack tip stress intensities. The focus is on delamination cracks which propagate under steady-state conditions. The steady-state analysis becomes accurate for a crack whose length is about one laminate thickness. Moreover, the analysis provides realistic fail-safe criteria for excluding delamination.

Copyright © 1995 by The American Society of Mechanical Engineers
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