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TECHNICAL PAPERS

Micromechanics Modeling of Electronic Composites

[+] Author and Article Information
Minoru Taya

Department of Mechanical Engineering, University of Washington, Box 352600, Seattle, WA 98195-2600

J. Eng. Mater. Technol 117(4), 462-469 (Oct 01, 1995) (8 pages) doi:10.1115/1.2804740 History: Received July 21, 1995; Online November 27, 2007

Abstract

The microstructure-macroproperty relation of electronic composites is studied by use of the Eshelby’s method which has been extended to treat the inclusion problem of thermal and electromagnetic behavior. Eshelby’s model has further been extended to the case of coupling behavior such as piezoelectric or pyroelectric behavior. When fillers embedded in the matrix are overlapped, the Eshelby’s model may not be applicable. Then one must use a percolation model, which is also discussed in this paper. Finally, the predictions based on these models are compared with experimental data to check the validity of the analytical modeling.

Copyright © 1995 by The American Society of Mechanical Engineers
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