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TECHNICAL PAPERS

Stress-Strain Analysis of a Taper-Taper Adhesive-Bonded Joint Under Cylindrical Bending

[+] Author and Article Information
Jack E. Helms

Albemarle Corporation, Baton Rouge, LA 70801

Chihdar Yang

Department of Mechanical Engineering, Wichita State University, Wichita, KS 67260

Su-Seng Pang

Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA 70803

J. Eng. Mater. Technol 121(3), 374-380 (Jul 01, 1999) (7 pages) doi:10.1115/1.2812389 History: Received June 23, 1998; Online November 27, 2007

Abstract

A model of a taper-taper adhesive-bonded joint under cylindrical bending has been derived using first-order laminated plate theory. Shear correction factors were used to account for transverse shear deformation. A FORTRAN program was written to integrate the resulting system of twelve simultaneous, linear, first-order, differential equations with variable coefficients. The Linear Shooting Method was used to solve the model. A finite element model was developed using the COSMOS/M commercial finite element package to verify the analytical model for a cross-ply laminate. The analytical model results agreed well with the finite element models and predicted peak adhesive stresses within about 2% of the finite element model.

Copyright © 1999 by The American Society of Mechanical Engineers
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