0
TECHNICAL PAPERS

Failure of a Ductile Adhesive Layer Constrained by Hard Adherends

[+] Author and Article Information
Toru Ikeda

Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, 6-10-1, Hakozaki, Higashi-ku, Fukuoka, 812-8581, Japan

Akira Yamashita

Boiler Plant Division, Kawasahi Heavy Industry Ltd., 2-11-1, Minamisuna, Koto-ku, Tokyo 136-0076, Japan

Deokbo Lee, Noriyuki Miyazaki

Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581, Japan

J. Eng. Mater. Technol 122(1), 80-85 (Jun 22, 1999) (6 pages) doi:10.1115/1.482769 History: Received August 05, 1998; Revised June 22, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Concept of the bond thickness effect on the fracture toughness of a crack in an adhesive layer
Grahic Jump Location
Two types of adhesive specimens
Grahic Jump Location
A crack in an adhesive region under uniform displacement
Grahic Jump Location
J-integral, G and Gapp. of the ECP and the TDCB as a function of bond thickness
Grahic Jump Location
Ratio of the strain energy stored in adhesive (Wadhesive) to that stored in whole specimen (Wwhole) with bond thickness
Grahic Jump Location
Comparison among the hoop stress distributions near a crack tip of a CT specimen, the HRR-field and the K-field at θ=0
Grahic Jump Location
An example of the finite element meshes. TDCB specimen with an adhesive layer whose thickness is 0.2 mm.
Grahic Jump Location
Distributions of hoop stress near a crack tip on the x-axis of the ECP and the TDCB for several bond thicknesses at J=1500 N/m
Grahic Jump Location
Distributions of triaxial stress near a crack tip along the x-axis of the ECP and the TDCB for several bond thicknesses at J=1500 N/m
Grahic Jump Location
Variation of the hoop stress and the triaxial stress near a crack tip along the x-axis at r=50 μm as a function of bond thickness
Grahic Jump Location
Variation of the crack tip opening displacement in the several bond thicknesses of the ECP at J=1500 N/m
Grahic Jump Location
Distributions of the plastic zone around crack tips in several bond thickness regions of the TDCB at J=1500 N/m(σM: von Mises’s equivalent stress)
Grahic Jump Location
Variation of the areas of plastic deformation zone with the bond thickness

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In