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TECHNICAL PAPERS

Failure of a Ductile Adhesive Layer Constrained by Hard Adherends

[+] Author and Article Information
Toru Ikeda

Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, 6-10-1, Hakozaki, Higashi-ku, Fukuoka, 812-8581, Japan

Akira Yamashita

Boiler Plant Division, Kawasahi Heavy Industry Ltd., 2-11-1, Minamisuna, Koto-ku, Tokyo 136-0076, Japan

Deokbo Lee, Noriyuki Miyazaki

Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581, Japan

J. Eng. Mater. Technol 122(1), 80-85 (Jun 22, 1999) (6 pages) doi:10.1115/1.482769 History: Received August 05, 1998; Revised June 22, 1999
Copyright © 2000 by ASME
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References

Gardon,  J. L., 1963, “Peel Adhesion. I. Some Phenomenological Aspects of the Test,” J. Appl. Polym. Sci., 7, pp. 625–641.
Mostovoy,  S., and Ripling,  E. J., 1971, “Effect of Joint Geometry on the Toughness of Epoxy Adhesives,” J. Appl. Polym. Sci., 15, pp. 661–673.
Bascom,  W. D., Cottington,  R. L., Jones,  R. L., and Peyser,  P., 1975, “The Fracture of Epoxy- and Elastomer-Modified Epoxy Polymers in Bulk and as Adhesives,” J. Appl. Polym. Sci., 19, pp. 2545–2562.
Bascom,  W. D., and Cottington,  R. L., 1976, “Effect of Temperature on the Adhesive Fracture Behavior of an Elastomer-Epoxy Resin.” J. Adhes., 7, pp. 333–346.
Kinloch,  A. J., and Shaw,  S. J., 1981, “The Fracture Resistance of a Toughened Epoxy Adhesive,” J. Adhes., 12, pp. 59–77.
Varias,  A. G., Suo,  Z., and Shih,  C. F., 1991, “Ductile Failure of a Constrained Metal Foil,” J. Mech. Phys. Solids, 39, No. 7, pp. 963–986.
Hsia,  K. J., Suo,  Z., and Yang,  W., 1994, “Cleavage due to Dislocation Confinement in Layered Materials,” J. Mech. Phys. Solids, 42, No. 6, pp. 877–896.
Tvergaard,  V., and Hutchinson,  J., 1996, “On the Toughness of Ductile Adhesive Joints,” J. Mech. Phys. Solids, 44, No. 5, pp. 789–800.
Ikeda, T., Miyazaki, N., Yamashita, A., and Munakata, T., 1995, “Elastic-Plastic Analysis of Crack in Ductile Adhesive Joint,” Composites for the Pressure Vessel Industry, ASME PVP-302, pp. 155–162.
Daghyani,  H. R., Ye,  L., and Mai,  Y. W., 1995, “Mode I Fracture Behavior of Adhesive Joints. Part. I. Relationship between Fracture Energy and Bond Thickness,” J. Adhes., 53, pp. 149–162.
Daghyani,  H. R., Ye,  L., and Mai,  Y. W., 1995, “Mode I Fracture Behavior of Adhesive Joints. Part II. Stress Analysis and Constraint Parameters,” J. Adhes., 53, pp. 163–172.
Ikeda,  T., Yamashita,  A., and Miyazaki,  N., 1998, “Elastic-Plastic Analysis of Crack in Adhesive Joint by Combination of Boundary Element and Finite Element Method,” Comput. Mech., 21, No. 6, pp. 533–539.
Mori, M., 1986, “FORT77; Numerical Programming,” Iwanami, pp. 90–114 (in Japanese).
Miyazaki,  N., Ikeda,  T., Soda,  T., and Munakata,  T., 1993, “Stress Intensity Factor Analysis of Interface Crack Using Boundary Element Method; Application of Contour-Integral Method,” Eng. Fract. Mech., 45, No. 5, pp. 599–610.
Murakami, Y. (Editor in Chief), 1987, Stress Intensity Factors Handbook 1, Pergamon Press, p. 9.
Rice,  J. R., 1968, “A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks,” ASME J. Appl. Mech., 35, pp. 379–386.
Hutchinson,  J. W., 1968, “Singular Behavior at the End of a Tensile Crack in a Hardening Material,” J. Mech. Phys. Solids, 16, pp. 13–31.
Rice,  J. R., and Rosengren,  G. F., 1968, “Plane Strain Deformation Near a Crack Tip in a Power-Law Hardening Material,” J. Mech. Phys. Solids, 16, pp. 1–12.
Lee,  D., Ikeda,  T., Todo,  M., Miyazaki,  N., and Takahashi,  K., 1999, “The Mechanism of Damage around Crack Tip in Rubber-Modified Epoxy Resin,” Trans. JSME, Series A, 65, No. 631, pp. 439–446 (in Japanese).
Chen,  T. K., and Jan,  Y. H., 1992, “Fracture Mechanism of Toughened Epoxy Resin with Bimodal Rubber-particle Size Distribution,” J. Mater. Sci., 27, pp. 111–121.
Anderson, T. L., 1995, Fracture Mechanics, CRC Press, pp. 117–181.

Figures

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Concept of the bond thickness effect on the fracture toughness of a crack in an adhesive layer
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Two types of adhesive specimens
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A crack in an adhesive region under uniform displacement
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J-integral, G and Gapp. of the ECP and the TDCB as a function of bond thickness
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Ratio of the strain energy stored in adhesive (Wadhesive) to that stored in whole specimen (Wwhole) with bond thickness
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Comparison among the hoop stress distributions near a crack tip of a CT specimen, the HRR-field and the K-field at θ=0
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An example of the finite element meshes. TDCB specimen with an adhesive layer whose thickness is 0.2 mm.
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Distributions of hoop stress near a crack tip on the x-axis of the ECP and the TDCB for several bond thicknesses at J=1500 N/m
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Distributions of triaxial stress near a crack tip along the x-axis of the ECP and the TDCB for several bond thicknesses at J=1500 N/m
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Variation of the hoop stress and the triaxial stress near a crack tip along the x-axis at r=50 μm as a function of bond thickness
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Variation of the crack tip opening displacement in the several bond thicknesses of the ECP at J=1500 N/m
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Distributions of the plastic zone around crack tips in several bond thickness regions of the TDCB at J=1500 N/m(σM: von Mises’s equivalent stress)
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Variation of the areas of plastic deformation zone with the bond thickness

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