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TECHNICAL PAPERS

Effect of Grain Boundaries on PLC Plastic Instabilities

[+] Author and Article Information
Zs. Kovács, D. Fátay, K. Nyilas, J. Lendvai

Department of General Physics, Eötvös University, Budapest, H-1518, P.O.B. 32, Budapest, Hungary

J. Eng. Mater. Technol 124(1), 23-26 (May 30, 2001) (4 pages) doi:10.1115/1.1420195 History: Received March 20, 2001; Revised May 30, 2001
Copyright © 2002 by ASME
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References

Figures

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Irregular small steps observed upon indentation near to the grain boundaries (lower curve) and a curve with regular instability steps obtained far away from grain boundaries. (The upper curve is shifted by 1 μm upwards.)
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Large-step event on the indentation depth curve
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(a) The penetration rate corresponding to the larger (•) and smaller (○) steps. The indentation curve can be divided into two distinct regular processes. (b) The load increase between subsequent steps in the two distinct processes.
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The hardness of the large-step curve. The large-step corresponds to the large hardness drop. ΔHV and Δo show the preceding hardness increase and the overshooting, respectively, relative to the baseline curve, which corresponds to the normal (large-step free) case.
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(a) The imprint near a triple junction and (b) the corresponding hardness load curve with two hardness drops
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The ΔF(F) function for the large-step event. Deviation from the fitted linear can be seen only near the large-step event.
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The result of the numerical simulation, where the steps in the strain indicate the PLC effect. The applied stress is also plotted. (a) Constant stress rate (b) constant stress rate with a stress rate pulse.

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