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TECHNICAL PAPERS

A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film

[+] Author and Article Information
Martin Y. M. Chiang, Chwan K. Chiang, Wen-li Wu

Polymers Division, NIST, Gaithersburg, MD 20899

J. Eng. Mater. Technol 124(2), 274-277 (Mar 26, 2002) (4 pages) doi:10.1115/1.1448522 History: Received April 25, 2001; Revised November 26, 2001; Online March 26, 2002
Copyright © 2002 by ASME
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References

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ABAQUS version 5.8, 1999, Hibbit, Karlsson and Sorensen, Providence, RI. Certain commercial code is identified in this paper in order to specify adequately the analysis procedure. In no case does such identification imply recommendation or endorsement by the National Institute of Standards and Technology (NIST) nor does it imply that they are necessarily the best available for the purpose.

Figures

Grahic Jump Location
A schematic of the cross-sectional bending of a bimaterial circular plate due to change in temperature
Grahic Jump Location
The variation of the normalized radius of curvature as function of the film deformability and film/substrate stiffness ratio. The lines represent the curvature based on Eq. (1) while the symbols are the results of FEA.
Grahic Jump Location
The dependence of the K*/K on the ratios of the film to substrate stiffness and of the film to substrate thickness
Grahic Jump Location
Ranges of the relative uncertainty propagation factor for CTE (Mα) and the elastic modulus (Me) for certain combinations of film/substrate

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