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TECHNICAL PAPERS

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

[+] Author and Article Information
X. Q. Shi, Z. P. Wang, Q. J. Yang

Gintic Institute of Manufacturing Technology, Nanyang Drive, Singapore 638075

H. L. J. Pang

School of Mechanical & Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

J. Eng. Mater. Technol 125(1), 81-88 (Dec 31, 2002) (8 pages) doi:10.1115/1.1525254 History: Received November 22, 2001; Revised July 08, 2002; Online December 31, 2002
Copyright © 2003 by ASME
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References

Figures

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SEM micrograph shows the microstructure in the 63Sn/37Pb solder. The Pb-rich phase is the light phase, while the Sn-rich phase is the darker one.
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Creep-time curves obtained at the temperature of 25°C for different stress levels
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Creep strain rate-time curves obtained at different temperatures and stress levels. Three times shown on each curve are times at the beginning of secondary stage, tertiary stage, and fracture point from left to right.
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63Sn/37Pb solder creep behavior at different temperatures. The vertical line on each data point shows the variation range of creep strain rate at certain testing condition.
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Stress exponent as a function of temperature for different stress regimes
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Creep strain rate versus reciprocal of temperature
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Activation energy as a function of temperature at the normalized shear stress level of τ/G=3×10−4
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Comparison of the creep deformation obtained from the experiments and that from new unified dislocation-controlled creep model
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Comparison of the creep deformation obtained from the experiments and those from the three diffusion controlled constitutive models
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Deformation mechanism map for 63Sn/37Pb eutectic solder alloy. The numbers on the iso-lines represent the creep strain rates (unit: 1/sec) at different testing conditions.
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Creep data published by different researchers for the eutectic solder. The gray iso-lines represent the creep strain rates same as those given in Fig. 10. The numbers are log10(dγ/dt).

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