Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

[+] Author and Article Information
Xiaoqin Huang, Assimina A. Pelegri

Mechanical & Aerospace Engineering Department, 98 Brett Road, Rutgers, The State University of New Jersey, Piscataway, NJ 08854, USA

J. Eng. Mater. Technol 125(4), 361-367 (Sep 22, 2003) (7 pages) doi:10.1115/1.1605109 History: Received December 15, 2002; Revised June 17, 2003; Online September 22, 2003
Copyright © 2003 by ASME
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4 μm×4 μm image of fused quartz surface with AFM Q-Scope™ 350 at scan rate 1 Hz (average height z̄=66.3 nm, root mean square deviation Rq=14.8 nm, mean deviation Ra=10.8 nm, and number of image points=300×300)
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Schematic presentation of TriboScope® interfaced with Q-Scope™ 350 (bold boxes denote the nanoindentation components, while normal boxes denote the AFM components)
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Cross section schematic of TriboScope® transducer
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Schematic diagram of a typical force versus displacement curve (h—indenter displacement; hf—final penetration depth; hmax—maximum displacement, i.e., penetration depth of indenter; P—force applied to indenter; Pmax—maximum force applied to indenter; S—contact stiffness)
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Schematic diagram of indentation (h—indenter displacement; hc—contact depth; hmax—maximum displacement, i.e., penetration depth)
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Plot of data for measuring the machine compliance (y-axis denotes the total system compliance Ctotal in μm/mN, while x-axis denotes Pmax−1/2)
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Tip area function curve (It is the computed contact area as a function of contact depth where the calculated C0=12.4996,C1=2.6553E+3, and C2=1.0020E+4)
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Image of low-k porous silica thin film surface at 3 different scan sizes (a) 0.5 μm×0.5 μm scan size at scan rate 1 Hz, (b) 1 μm×1 μm scan size at scan rate 1 Hz, and (c) 5 μm×5 μm scan size at scan rate 0.5 Hz
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Force versus displacement curves at different peak loads
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Hardness H versus penetration depth hmax relationship
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Young’s modulus E versus penetration depth hmax relationship
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Force versus displacement curves at peak loads 50 μN of low-k porous silica thin film. Measured reduced Young’s modulus, Er=2.84±0.08 GPa, and hardness H=0.38±0.02 GPa.




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