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TECHNICAL PAPERS

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

[+] Author and Article Information
Xiaoqin Huang, Assimina A. Pelegri

Mechanical & Aerospace Engineering Department, 98 Brett Road, Rutgers, The State University of New Jersey, Piscataway, NJ 08854, USA

J. Eng. Mater. Technol 125(4), 361-367 (Sep 22, 2003) (7 pages) doi:10.1115/1.1605109 History: Received December 15, 2002; Revised June 17, 2003; Online September 22, 2003
Copyright © 2003 by ASME
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References

Trimmer, W. S., 1996, Micromechanics and MEMS: Classic and Seminar Papers to 1990, IEEE Press, Piscatawy, NJ.
Stokes, R. J., and Evans, D. F., 1997, Fundamentals of Interfacial Engineering, Wiley-VCH, Inc.
Murakami,  Y., Tanaka,  K., Itokazu,  M., and Shimamoto,  A., 1994, “Elastic Analysis of Triangular Pyramidal Indentation by the Finite-Element Method and its Application to Nano-Indentation Measurement of Glasses,” Philos. Mag. A, 69(6), pp. 1131–1153.
Larsson,  P. L., Giannakopoulos,  A. E., Soderlund,  E., Rowcliffe,  D. J., and Vestergaard,  R., 1996, “Analyis of Berkovich Indentation,” Int. J. Solids Struct., 33(2), pp. 221–248.
Pethica,  J. B., Hutchings,  R., and Oliver,  W. C., 1983, “Hardness Measurement at Penetration Depths as Small as 20 nm,” Philos. Mag. A, 48(4), pp. 593–606.
Doerner,  M. F., and Nix,  W. D., 1986, “A Method for Interpreting the Data From Depth Sensing Indentation Instruments,” J. Mater. Res., 1(4), pp. 601–609.
Oliver,  W. C., and Pharr,  G. M., 1992, “An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments,” J. Mater. Res., 7(6), pp. 1564–1583.
Bertrand-Lambotte,  P., Loubet,  J. L., Verpy,  C., and Pavan,  S., 2001, “Nano-Indentation, Scratching and Atomic Force Microscopy for Evaluating the Mar Resistance of Automotive Clearcoats: Study of the Ductile Scratches,” Thin Solid Films, 398–399, pp. 306–312.
Bamber,  M. J., Cooke,  K. E., Mann,  A. B., and Derby,  B., 2001, “Accurate Determination of Young’s Modulus and Poisson’s Ratio of Thin Films by a Combination of Acoustic Microscopy and Nanoindentation,” Thin Solid Films, 398–399, pp. 299–305.
Chou,  W.-J., Yu,  G.-P., and Huang,  J.-H., 2002, “Mechanical Properties of TiN Thin Film Coatings on 304 Stainless Steel Substrates,” Surf. Coat. Technol., 149, pp. 7–13.
Barshilia,  H. C., and Rajam,  K. S., 2002, “Characterization of Cu/Ni Multilayer Coatings by Nanoindentation and Atomic Force Microscopy,” Surf. Coat. Technol., 155(2–3), pp. 195–202.
Hyun,  S. H., Kim,  T. Y., Kim,  G. S., and Park,  H. H., 2000, “Synthesis of Low-k Porous Silica Films via Freeze Drying,” J. Mater. Sci. Lett., 19, pp. 1863–1866.
Quesant Instrument Corporation, 2002, “Q-Scope 350 Operator’s Manual,”
Simpson,  G. J., Sedin,  D. L., and Rowlen,  K. L., 1999, “Surface Roughness by Contact Versus Tapping Mode Atomic Force Microscopy,” Langmuir, 15, pp. 1429–1434.
Elam,  J. W., Sechrist,  Z. A., and George,  S. M., 2002, “ZnO/Al2O3 Nanolaminates Fabricated by Atomic Layer Deposition: Growth and Surface Roughness Measurements,” Thin Solid Films, 414, pp. 43–55.
Mesarovic,  S. D., and Fleck,  N. A., 1999, “Spherical Indentation of Elastic-Plastic Solids,” Proc. R. Soc. London, Ser. A, 455, pp. 2707–2728.
Hysitron Inc., 2002, “TriboScope Nanomechanical Testing System—User’s Manual.”

Figures

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4 μm×4 μm image of fused quartz surface with AFM Q-Scope™ 350 at scan rate 1 Hz (average height z̄=66.3 nm, root mean square deviation Rq=14.8 nm, mean deviation Ra=10.8 nm, and number of image points=300×300)
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Schematic presentation of TriboScope® interfaced with Q-Scope™ 350 (bold boxes denote the nanoindentation components, while normal boxes denote the AFM components)
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Cross section schematic of TriboScope® transducer
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Schematic diagram of a typical force versus displacement curve (h—indenter displacement; hf—final penetration depth; hmax—maximum displacement, i.e., penetration depth of indenter; P—force applied to indenter; Pmax—maximum force applied to indenter; S—contact stiffness)
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Schematic diagram of indentation (h—indenter displacement; hc—contact depth; hmax—maximum displacement, i.e., penetration depth)
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Plot of data for measuring the machine compliance (y-axis denotes the total system compliance Ctotal in μm/mN, while x-axis denotes Pmax−1/2)
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Tip area function curve (It is the computed contact area as a function of contact depth where the calculated C0=12.4996,C1=2.6553E+3, and C2=1.0020E+4)
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Image of low-k porous silica thin film surface at 3 different scan sizes (a) 0.5 μm×0.5 μm scan size at scan rate 1 Hz, (b) 1 μm×1 μm scan size at scan rate 1 Hz, and (c) 5 μm×5 μm scan size at scan rate 0.5 Hz
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Force versus displacement curves at different peak loads
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Hardness H versus penetration depth hmax relationship
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Young’s modulus E versus penetration depth hmax relationship
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Force versus displacement curves at peak loads 50 μN of low-k porous silica thin film. Measured reduced Young’s modulus, Er=2.84±0.08 GPa, and hardness H=0.38±0.02 GPa.

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