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TECHNICAL PAPERS

Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints

[+] Author and Article Information
Deok-Bo Lee

The BK21 Division for Research and Education in Mechanical Engineering, Hangyang University, 17 Haengdang-dong, Sungdong-ku, Seoul 133-791, Korea

Toru Ikeda, Noriyuki Miyazaki

Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, 6-10-1 Hakozaki, Higashi-ku, Fukuoka 812-8581, Japan

Nak-Sam Choi

Department of Mechanical Engineering, Hanyang University, 1271 Sa-1 dong, Ansan-si, Kyunggi-do 425-791, Korea

J. Eng. Mater. Technol 126(1), 14-18 (Jan 22, 2004) (5 pages) doi:10.1115/1.1631433 History: Received December 31, 2002; Revised September 03, 2003; Online January 22, 2004
Copyright © 2004 by ASME
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References

Gardon,  J. L., 1963, “Peel Adhesion. I. Some Phenomenological Aspects of the Test,” J. Appl. Polym. Sci., 7, pp. 625–641.
Mostovoy,  S., and Ripling,  E. J., 1971, “Effect of Joint Geometry on the Toughness of Epoxy Adhesives,” J. Appl. Polym. Sci., 15, pp. 661–673.
Bascom,  W. D., Cottington,  R. L., Jones,  R. L., and Peyser,  P., 1975, “The Fracture of Epoxy and Elastomer-Modified Epoxy Polymers in Bulk and as Adhesives,” J. Appl. Polym. Sci., 19, pp. 2545–2562.
Bascom,  W. D., and Cottington,  R. L., 1976, “Effect of Temperature on the Adhesive Fracture Behavior of an Elastomer-Epoxy Resin,” J. Adhes., 7, pp. 333–346.
Kinloch,  A. J., and Shaw,  S. J., 1981, “The Fracture Resistance of a Toughened Epoxy Adhesive,” J. Adhes., 12, pp. 59–77.
Daghyani,  H. R., Ye,  L., and Mai,  Y. W., 1995, “Mode I Fracture Behavior of Adhesive Joints. Part I. Relationship between Fracture Energy and Bond Thickness,” J. Adhes., 53, pp. 149–162.
Daghyani,  H. R., Ye,  L., and Mai,  Y. W., 1995, “Mode I Fracture Behavior of Adhesive Joints. Part II. Stress Analysis and Constraint Parameters,” J. Adhes., 53, pp. 163–172.
Yan,  C., Mai,  Y. W., Yuan,  Q., Ye,  L., and Sun,  J., 2001, “Effects of Substrate Materials on Fracture Toughness Measurement in Adhesive Joints,” Int. J. Mech. Sci., 43, pp. 2091–2102.
Yan,  C., Yiao,  K., Ye,  L., and Mai,  Y. W., 2002, “Numerical and Experimental Studies on the Fracture Behavior of Rubber-Toughened Epoxy in Bulk Specimen and Laminated Composites,” J. Mater. Sci., 37, pp. 921–927.
Chai,  H., 1984, “The Characterization of Mode I Delamination Failure in Non-Woven, Multidirectional Laminates,” Composites, 15(4), pp. 277–290.
Chai,  H., 1986, “On the Correlation Between the Mode I Failure of Adhesive Joints and Laminated Composites,” Eng. Fract. Mech., 24(3), pp. 413–431.
Chai,  H., 1987, “A Note on Crack Trajectory in an Elastic Strip Bounded by Rigid Substrates,” Int. J. Fract., 32, pp. 211–213.
Ikeda,  T., Yamashita,  A., Lee,  D. B., and Miyazaki,  N., 2000, “Failure of a Ductile Adhesive Layer Constrained by Hard Adherends,” ASME J. Eng. Mater. Technol., 122(1), pp. 80–85.
Varias,  A. G., Suo,  Z., and Shih,  C. F., 1991, “Ductile Failure of a Constrained Metal Foil,” J. Mech. Phys. Solids, 39(7), pp. 963–986.
Hsia,  K. J., Suo,  Z., and Yang,  W., 1994, “Cleavage due to Dislocation Confinement in Layered Materials,” J. Mech. Phys. Solids, 42(6), pp. 877–896.
Tvergaard,  V., and Hutchinson,  J., 1996, “On the Toughness of Ductile Adhesive Joints,” J. Mech. Phys. Solids, 44(5), pp. 789–800.
Wegman, R. F., 1989, Surface Preparation Techniques for Adhesive Bonding, Noyes/William Andrew Publishing, ISBN 0-8155-1198-1, pp. 269.
Holik, A. S., Kambour, R. P., Hobbs, S. Y., and Fink, D. G., 1979, “Grinding and Polishing Techniques for Thin Sectioning of Polymeric Materials for Transmission Light Microscopy,” Microstructural Science, Elsevier Publishing Company, New York, 7 , pp. 357–367.
Ikeda, T., Komohara Y., and Miyazaki, N., “Measurement of Mixed Mode Fracture Toughness of an Interface Crack in Electronic Devices,” Advanced Electronic Packaging, EEP-19-2, ASME, New York, pp. 1437.
Ikeda,  T., and Sun,  C. T., 2001, “Stress Intensity Factor Analysis for an Interface Crack between Dissimilar Isotropic Materials under Thermal Stress,” Int. J. Fract., 111, pp. 229–249.
Lee,  D. B., Ikeda,  T., Miyazaki,  N., and Choi,  N. S., 2002, “Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode Conditions,” Eng. Fract. Mech., 69(12), pp. 1363–1375.
Lee,  D. B., Ikeda,  T., Miyazaki,  N., and Choi,  N. S., 2002, “Damage Zone around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum,” ASME J. Eng. Mater. Technol., 124(2), pp. 206–214.

Figures

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Two typical types of bond-thickness effects on the fracture toughness of adhesive joints
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Compact tension (CT) specimen of an adhesive joint (W=48 mm,a/W≈0.5)
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Compact tension (CT) specimen of bulk epoxy resin (W=24 mm,a/W≈0.5,thickness=8 mm)
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Load-displacement relationship of specimens: (a) adhesive joints; and (b) bulk adhesive.
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Fracture energy of adhesive joints and bulk adhesive (Each point indicates the average of 10 measurements)
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Morphology of the rubber-modified epoxy resin around pre-cracks and along the adhesive-adherend interfaces in virgin specimens: (a) in an adhesive layer with a thickness of 1.5 mm; (b) in an adhesive layer with a thickness of 0.3 mm; and (c) in an adhesive layer with a thickness of 0.1 mm.
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Schematic pattern of the distribution of rubber particles in an adhesive layer between aluminum adherends
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Damage of the rubber modified epoxy resin around pre-cracks and along the adhesive-adherend interfaces in damaged specimens: (a) in an adhesive layer with a thickness of 2.1 mm; (b) in an adhesive layer with a thickness of 1.5 mm; (c) in an adhesive layer with a thickness of 0.7 mm; (d) in an adhesive layer with a thickness of 0.3 mm; and (e) in an adhesive layer with a thickness of 0.1 mm.

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