Thermal Shock Strength of a Semi-infinite Piezoelectric Medium

[+] Author and Article Information
Bao-Lin Wang, Yu-Guo Sun

School of Aerospace, Mechanical and Mechatronic Engineering J11, The University of Sydney, Sydney, NSW 2006, Australiae-mail: wangbl2001@hotmail.com

J. Eng. Mater. Technol 126(4), 450-456 (Nov 09, 2004) (7 pages) doi:10.1115/1.1789964 History: Received October 07, 2003; Revised February 21, 2004; Online November 09, 2004
Copyright © 2004 by ASME
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A semi-infinite piezoelectric medium with a surface electrically conducting crack
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Variation of the thermal stress σyy(x,t) and electric field Ex(x,t) with time at selected positions (σ0=−λ̃11T0,E0=β̃3T0)
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Variation of the stress-intensity factor K1 with time at selected crack lengths (σ0=−λ̃11T0)
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Variation of the electric-field intensity factor KE with time at selected crack lengths (E0=β̃3T0)
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Normalized stress and electric field intensity factors with normalized time
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Variation of thermal stress intensity factors with crack lengths (σ0=−λ̃11T0)
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Crack-growth trajectory (c0=0.1 mm,σ0=−λ̃11T0)
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Thermal shock resistance curve (c is the crack depth of the surface crack. Stress-based failure for crack lengths smaller than ct, and fracture-based failure for crack lengths larger than ct)




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