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RESEARCH PAPERS

Effect of Geometry and Materials on Residual Stress Measurement in Thin Films by Using the Focused Ion Beam

[+] Author and Article Information
Ki-Ju Kang

Department of Mechanical Engineering, Chonnam National University, Kwangju, 500-757, Koreae-mail: kjkang@chonnam.ac.kr

Severine Darzens

Princeton Materials Institute, Princeton University, Princeton, NJ 08540

Gee-Seob Choi

Department of Mechanical Engineering, Chonnam National University, Kwangju, 500-757, Korea

J. Eng. Mater. Technol 126(4), 457-464 (Nov 09, 2004) (8 pages) doi:10.1115/1.1789965 History: Received October 21, 2003; Revised April 26, 2004; Online November 09, 2004
Copyright © 2004 by ASME
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References

Figures

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A schematic of a focused ion beam slot introduced into a film, defining the coordinates
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Close-up of a finite element model simulating the slot introduced into the film
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Comparisons of the displacements in the presence of a uniform compression in a thin film estimated by an analytic solution Eq. (2) for a two-dimensional crack, with the displacements by finite element analyses for two-dimensional slots having various widths
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Displacements in the presence of a uniform compression in a thin film at various distances from the slot end, in comparison with the displacements along the center line (y=0). The inset represents the configuration of the slot.
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Comparison of the displacements in the presence of a uniform compression in a thin film due to introducing a two-dimensional slot, with the ones due to introducing three-dimensional slots with various lengths. The inset indicates a close-up near the slot edge.
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The coefficient λ of Eq. (2) as a function of Dunder’s parameters α and β (see Ref. 23)
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Displacements determined for various slot depths using the analytic solution Eq. (2), with (α,β) being the Dundurs’ elastic misfit parameters, (a) a/h=0.3, (b) a/h=0.5, (c) a/h=0.7, (d) a/h=0.9
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Scanning electron images of a region of the DLC film before and after the introduction of the FIB slot
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Displacement distribution measured from SEM images of the DLC film for one of the slots by using the DIC software (a) left side, (b) right side
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Comparisons of the measured displacements from Fig. 9 (ordinate), with the displacement obtained by using the analytic solution Eq. (2) (abscissa) for an assumed residual stress of −1 GPa. The slope gives the actual residual stress in GPa (as shown). The results derived from the displacements measured on the left and right sides of the slot are in close agreement with each other.
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Scanning electron images of a region of the TGO film before and after the introduction of the FIB slot
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Displacement distribution measured from SEM images of the TGO film for one of the slots by using the DIC software (a) left side, (b) right side
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Comparisons of the measured displacements from Fig. 12 (ordinate), with the displacement obtained by using the analytic solution Eq. (2) (abscissa) for an assumed residual stress of −1 GPa. The slope gives the actual residual stress in GPa (as shown). The results derived from the displacements measured on the left and right sides of the slot are in close agreement with each other.

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