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RESEARCH PAPERS

Measurement and Prediction of the Residual Stress Field Generated by Side-Punching

[+] Author and Article Information
A. H. Mahmoudi, S. Hossain, D. J. Smith

Department of Mechanical Engineering, University of Bristol, Queen’s Building, University Walk, Bristol, BS8 1TR, UK

D. Stefanescu, P. J. Withers

Manchester Material Science Centre, University of Manchester, Grosvenor St., Manchester, M1 7HS, UK

C. E. Truman1

Department of Mechanical Engineering, University of Bristol, Queen’s Building, University Walk, Bristol, BS8 1TR, UKc.e.truman@bris.ac.uk

1

Corresponding author.

J. Eng. Mater. Technol 128(3), 451-459 (Mar 20, 2006) (9 pages) doi:10.1115/1.2203103 History: Received July 13, 2005; Revised March 20, 2006

Side-punching is proposed as a method of introducing a well-defined residual stress field into a laboratory-sized test specimen. Such a specimen may subsequently be used to assess the influence of residual stresses on the fracture behavior of materials. Side-punching consists of simultaneously indenting opposite faces of a plate of material with rigid tools, using sufficient force to cause localized yielding over a finite-sized volume of material adjacent to the punching tools. This paper presents experimental measurements, obtained using three independent measurement techniques, of the residual stress field generated in an aluminium alloy plate after side-punching. Incremental center hole drilling is used to determine the near-surface residual stress field, while synchrotron x-ray diffraction and deep hole drilling are used to measure the through-thickness residual stress field along a path linking the two punch center points. Finite element (FE) predictions are also presented and compared to the measurements. There is very good agreement between all three sets of measurements and the FE results, which all show that the through-thickness residual stresses are compressive and attain a maximum value at the center of the plate. The results confirm the potential use of side-punching in residual stress-crack interaction studies.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic diagram illustrating side-punching: (a) Two cylindrical, flat-ended punching tools indent an aluminium alloy, Al2650, plate, and (b) cross section indicating the ICHD, DHD, and HEXRD measurement locations

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Figure 2

Hardening behavior of Al2650 alloy in uniaxial tension and compression (9). The material had been solution heat treated for 1h, cold water quenched, uniaxially stretched 2%, and finally aged for 19h at 190°C (T6).

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Figure 3

ICHD measured relaxed strains on the aluminium alloy plate. Also shown is the strain gage rosette orientation

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Figure 4

The near surface in-plane residual stresses obtained from ICHD measurements

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Figure 5

Schematic diagram illustrating the four steps of the DHD measurement technique

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Figure 6

In-plane residual stresses measured by the DHD measurement technique showing the position of the measurement inset

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Figure 7

Schematic diagram of the definition of the sampling gauge. The strain measurement direction is also shown

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Figure 8

Through-thickness variation of the d0 lattice spacing as measured by synchrotron x-ray diffraction on an unpunched aluminium alloy plate

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Figure 9

In-plane residual stresses measured by synchrotron x-ray diffraction

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Figure 10

Details of the finite element mesh employed showing the planes of symmetry

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Figure 11

Finite element predictions of the residual stress field on a central plane through the punched specimen. Also shown is the extent of plasticity occurring in the specimen as a result of punching.

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Figure 12

Finite element predictions of the residual stress field along a path linking the two punch center points

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Figure 13

Comparison between the predicted and measured residual stresses (three measurement methods) through the thickness of the Al2650 plate following side-punching

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Figure 14

Near-surface comparison between the predicted and measured residual stresses (three measurement methods) through the thickness of the Al2650 plate following side-punching

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