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RESEARCH PAPERS

Modeling the Influence of Drying Conditions on the Stress Buildup During Drying of Paperboard

[+] Author and Article Information
Magnus Östlund

 KTH Solid Mechanics, Osquars backe 1, S-100 44, Stockholm, Swedenmagnus@hallf.kth.se

J. Eng. Mater. Technol 128(4), 495-502 (Apr 19, 2006) (8 pages) doi:10.1115/1.2345440 History: Received August 05, 2005; Revised April 19, 2006

This paper concerns the drying process in the manufacturing of paperboard. Of particular interest are the effects of through-thickness property variation in paperboard during drying. In addition, resulting average properties from different drying histories are discussed. A mathematical model of the drying process is presented. It allows the moisture and temperature histories, the stress and strain histories, and the buildup of mechanical properties to be simulated. The temperature of the heating medium, the humidity and pressure of the ambient air, and either applied loads or prescribed strains are required input data. For symmetric convective drying, the ambient temperature, the humidity, and the thickness of the board were varied. For drying on a heated plate, the temperature of the plate and the thickness of the board were varied. Results regarding the moisture history, the stiffness development, and the buildup of residual stresses are presented and compared to literature experimental data. Also, sheets with a varying fiber base through the thickness, which affects both the moisture history and the influence of moisture on shrinkage, were studied. The model was shown to yield predictions qualitatively inline with empirical knowledge.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

The coordinate system

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Figure 2

Development of the moisture profile for symmetric convective drying at 180°C and 5% RH. Initial moisture ratio was 1.3 throughout the paperboard, while initial temperature was 23°C.

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Figure 3

Development of the moisture gradient at the surface for 180°C (solid curve) and 55°C drying (dotted curve) at 5% RH

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Figure 4

Residual stress distribution for 180°C (solid curve) and 55°C convective drying (dotted curve) at 5% RH

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Figure 5

Development of the moisture distribution in one-sided drying (closed, heated surface to the left in the graph) for a temperature of 150°C of the hot surface, in a 200g∕m2 paper

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Figure 6

The development of the MD stress in one-sided drying (closed, heated surface to the left in the graph) for a temperature of 150°C of the hot surface, in a 200g∕m2 paper

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Figure 7

Residual stress distribution after convective drying with 55°C and 50% RH in the ambient air of a 300g∕m2 paperboard where the central 150g∕m2 of the board was made from unbeaten pulp

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