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Research Papers

Critical Depth of Cut and Specific Cutting Energy of a Microscribing Process for Hard and Brittle Materials

[+] Author and Article Information
Jiunn-Jyh Junz Wang1

Department of Mechanical Engineering, National Cheng Kung University, No. 1 Dasyue Road, Tainan 701, Taiwanjjwang@mail.ncku.edu.tw

Yong-Yuan Liao

Department of Mechanical Engineering, National Cheng Kung University, No. 1 Dasyue Road, Tainan 701, Taiwan

1

Corresponding author.

J. Eng. Mater. Technol 130(1), 011002 (Dec 20, 2007) (6 pages) doi:10.1115/1.2806253 History: Received October 26, 2006; Revised August 29, 2007; Published December 20, 2007

This paper investigated the scribing process characteristics of the hard and brittle materials including single crystal silicon, STV glass, and sapphire substrate. Under various cutting angles, major process characteristics are examined including the groove geometry, specific cutting energy, and critical depth of cut at the onset of ductile-to-brittle cutting transition. As the cutting depth increases, groove geometry clearly reveals the ductile-to-brittle transition from the plastic deformation to a brittle fracture state. The material size effect in the ductile region as well as the transition in scribing behavior is well reflected by change in the specific cutting energy. Further, it is shown that the change of specific cutting energy as a function of the cutting depth can serve as a criterion for estimating the critical depth of cut. Such estimated critical depth of cut is confirmed by measurement from a 3D confocal microscope. The critical depths of cut for these hard materials are found to be between 0.1μm and 0.5μm depending on the materials and cutting angles.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

SEM photo of the diamond tool tip

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Figure 10

Groove profiles of sapphire at various cutting depths, γ=10°: (a) d=0.2μm in the ductile region, (b) d=0.5μm in the transitional region, and (c) and (d) in the brittle region

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Figure 9

The profile and OM photo of grooves for sapphire, γ=10deg: (a) and (b) in the ductile region and (c) and (d) in the brittle region

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Figure 8

(a) Measured CDC from a 3D confocal microscope and (b) the rough trace on the groove bottom along the scribing trace of SCS

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Figure 7

Estimated CDC for the CDC (SCS, γ=15deg)

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Figure 6

Specific cutting energies at different cutting angles for (a) SCS, (b) STV-glass, and (c) sapphire. γ=5deg: –∙–; γ=10deg: …; γ=15deg: —; γ=20deg: – –.

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Figure 5

The specific cutting energy for three materials at different cutting angles for (a) γ=5deg, (b) γ=10deg, (c) γ=15deg, and (d) γ=20deg. SCS1: —; SCS2: —; GTV glass1: …; GTV glass2: …; sapphire1: –∙–; sapphire2: –∙–.

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Figure 4

Cutting forces for SCS at different cutting angles γ

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Figure 3

The horizontal cutting forces for three materials at different angles for (a) γ=5deg, (b) γ=10deg, (c) γ=15deg, and (d) γ=20deg. SCS1: —; SCS2: —; GTV glass1: …; GTV glass2: …; sapphire1: -∙-; sapphire2: -∙-.

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Figure 2

(a) The scribing process, (b) the front view, and (c) the side view

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