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Research Papers

Influence of Ply Sequence and Thermoelastic Stress Field on Asymmetric Delamination Growth Behavior Emanating From Elliptical Holes in Laminated FRP Composites

[+] Author and Article Information
Brajabandhu Pradhan

Mechanical Engineering Department, Indian Institute of Technology, Kharagpur, 721 302 West Bengal, Indiabpradhan@mech.iitkgp.ernet.in

Poosa Ramesh Babu

Mechanical Engineering Department, Indian Institute of Technology, Kharagpur, 721 302 West Bengal, India

J. Eng. Mater. Technol 130(1), 011006 (Dec 21, 2007) (9 pages) doi:10.1115/1.2806277 History: Received February 23, 2007; Revised September 29, 2007; Published December 21, 2007

The present study encompasses the influence of ply sequence and thermoelastic stress field on asymmetric delamination growth behavior emanating from elliptical holes in laminated fiber reinforced polymeric composites. Results, emphasizing the effect of thermal residual stresses on delamination growth behavior of the composite laminates subjected to two different loading conditions, i.e., in-plane tensile and compressive loadings, are presented. Two sets of full three-dimensional finite element analyses have been performed to calculate the displacements and interlaminar stresses along the delaminated interfaces responsible for the delamination onset and propagation. Modified crack closure integral methods based on the concepts of linear elastic fracture mechanics have been followed to evaluate the individual modes of strain energy release rates along the delamination front. In each case, the delamination is embedded at a different depth along the thickness direction of the laminates. It is observed that the fiber orientation of the plies bounding the delamination front significantly influences the distribution of the local strain energy release rate. Also, the residual thermal stresses have a detrimental effect on the laminates subjected to compressive loading and more so in the case of laminates with delaminations existing closer to the top and bottom surfaces of the laminate.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of laminate specimen under uniaxial extension with two symmetrically located embedded elliptical delaminations with respect to the midplane (z=0) of the laminate emanating from the edge of the elliptical hole (for uniaxial compression εx=−0.01)

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Figure 2

Transverse midplane (x=0)

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Figure 3

Midplane symmetry constraints for the upper half of the laminate specimen

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Figure 4

Exploded view of [0‖+45∣−45∣90]2s laminate with an annular shaped elliptical interfacial delamination in the resin layer emanating from the edge of a central elliptical hole

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Figure 5

Modeling of elliptical delamination front propagation

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Figure 6

Finite element meshing of the laminate specimen containing annular shaped elliptical delamination along the edge of the central elliptical hole

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Figure 7

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 0∣45 interface of Laminate A [0‖45∣−45∣90∣S∣S∣90∣−45∣45‖0] with and without consideration of thermal residual stresses and in-plane tensile load

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Figure 8

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 0∕45 interface of Laminate A [0∣45∣−45∣90∣S∣S∣90∣−45∣45‖0] with and without consideration of thermal residual stresses and in-plane compressive load

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Figure 9

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 45∣−45 interface of Laminate B [0∣45‖−45∣90∣S∣S∣90∣−45‖45∣0] with and without consideration of thermal residual stresses and in-plane tensile load

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Figure 10

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 45∣−45 interface of Laminate B [0∣45‖−45∣90∣S∣S∣90∣−45‖45∣0] with and without consideration of thermal residual stresses and in-plane compressive load

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Figure 11

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the −45∣90 interface of Laminate C [0∣45∣−45‖90∣S∣S∣90‖−45∣45∣0] with and without consideration of thermal residual stresses and in-plane tensile load

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Figure 12

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the −45∣90 interface of Laminate C [0∣45∣−45‖90∣S∣S∣90‖−45∣45∣0] with and without consideration of thermal residual stresses and in-plane compressive load

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Figure 13

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 90∣0 interface of Laminate D [0∣45∣−45∣90‖S∣S‖90∣−45∣45∣0] with and without consideration of thermal residual stresses and in-plane tensile load

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Figure 14

Comparison of (a) GI, (b) GII, and (c) GIII distributions at different angles along the elliptical delamination front located symmetrically at the 90∣0 interface of Laminate D [0∣45∣−45∣90‖S∣S‖90∣−45∣45∣0] with and without consideration of thermal residual stresses and in-plane compressive load

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