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Technical Briefs

Creep Behavior of Copper and Cu–0.3Cr–0.1Ag Alloy

[+] Author and Article Information
A. Akbari-Fakhrabadi

Department of Materials Engineering, Islamic Azad University, Sirjan Branch, Sirjan, 87185-4563, Iran

R. Mahmudi1

School of Metallurgical and Materials Engineering, University of Tehran, PO Box 11155-4563, Tehran, Iranmahmudi@ut.ac.ir

A. Karsaz, A. R. Geranmayeh

School of Metallurgical and Materials Engineering, University of Tehran, PO Box 11155-4563, Tehran, Iran

1

Corresponding author.

J. Eng. Mater. Technol 132(4), 044501 (Sep 29, 2010) (4 pages) doi:10.1115/1.4002356 History: Received June 01, 2010; Revised July 18, 2010; Published September 29, 2010; Online September 29, 2010

The creep behavior of Cu–0.3Cr–0.1Ag alloy was investigated by the impression creep testing technique and compared with that of pure copper under constant punching stress in the range 80–550 MPa at temperatures in the range 688–855 K. The enhanced creep resistance of the Cr- and Ag-containing alloys was attributed to the distribution of Cr-rich phase in the copper matrix. Assuming a power-law relationship between the impression stress and velocity, the average stress exponents of 6.0–7.5 and 6.4–8.0 were obtained for pure Cu and CuCrAg, respectively. It was found that the average activation energies were 112.4kJmol1 and 143.5kJmol1 for the pure Cu and CuCrAg alloys, respectively. These activation energies are close to 138kJmol1 for dislocation climb in Cu. This, together with the stress exponents of about 7, suggests that the operative creep mechanism is dislocation climb controlled by dislocation pipe diffusion.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

Impression creep curves obtained at 725 K under different stress levels for (a) Cu and (b) CuCrAg

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Figure 2

Impression creep curves obtained at different temperatures: (a) Cu, σ=140 MPa and (b) CuCrAg, σ=400 MPa

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Figure 3

(a) SEM micrograph of the CuCrAg material showing the dispersion of Cr-rich particles in the Cu matrix and (b) EDX spectrum of the same particles

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Figure 4

Normalized steady-state impression rate as function of normalized punching stress at different temperatures for determining n-values of: (a) Cu and (b) Cu–Cr–Ag

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Figure 5

Plots of the temperature-dependence of the normalized steady-state impression rate at different constant punching stress for determining Q-values of (a) Cu and (b) CuCrAg

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