Research Papers

Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper

[+] Author and Article Information
Khaled J. Al-Fadhalah

Department of Mechanical Engineering, College of Engineering and Petroleum,  Kuwait University, P.O. Box 5969, Safat 13060, Kuwaitfadhalah@kuc01.kuniv.edu.kw

J. Eng. Mater. Technol 134(1), 011001 (Dec 06, 2011) (9 pages) doi:10.1115/1.4004069 History: Received June 30, 2010; Revised March 06, 2011; Accepted March 07, 2011; Published December 06, 2011; Online December 06, 2011

The effect of texture on grain boundary character distribution (GBCD) in thermomechanically processed oxygen-free high-conductivity copper has been investigated. Copper samples were cold rolled to a reduction in thickness of 50% and then annealed for 60 min in the range of 400–600°C. GBCD and texture were measured using electron backscatter diffraction. The fraction of special boundaries (Σ3, Σ9, and Σ27) varied from 59% to 71%, with the maximum in the sample annealed at 500°C. The results indicate that cold rolling provided a strong texture of brass type. It was found that the sample annealed at 500°C have texture components of cube, Goss, rotated-Goss, and Y orientations. These texture components were in relation with the formation of annealing twins and Σ3 boundaries. It was also shown that twin-induced GBCD evolution occurred by strain-induced boundary migration, multiple twinning, and conventional recrystallization. Annealing at 600°C caused full recrystallization and grain growth, showing a strong cube recrystallization texture. The grain growth was found to hinder the formation of special boundaries.

Copyright © 2012 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 1

Optical microscope micrographs of copper microstructure for sample A (a), sample B (b), sample C (c), and sample D (d)

Grahic Jump Location
Figure 3

OIM for sample A (a), sample B (b), sample C (c), and sample D (d). Maps were made in the ND. Different colors designate different crystallographic orientations (see standard triangle).

Grahic Jump Location
Figure 4

General misorientation statistics for sample A (a), sample B (b), sample C (c), and sample D (d)

Grahic Jump Location
Figure 5

ODF serials for sample A (a), sample B (b), sample C (c), and sample D (d). The capital characters in the figure denote the texture components as following: C, copper component {112}<111¯>; S, S component {123}<634¯>; B, brass component {011}<211¯>; G, Goss component {011}<100>; Gr , rotated Goss {011}<011¯>; W, cube component {100}<0 0 1>; Y, Y component {111}<112¯>.

Grahic Jump Location
Figure 6

Orientation density f(g) of sample A along (a) α fiber and (b) β fiber. (c) Position f(g) in Euler space for β fiber

Grahic Jump Location
Figure 7

{111} and {100} Pole figures for sample A (a), sample B (b), sample C (c), and sample D (d)

Grahic Jump Location
Figure 8

OIM maps for sample E. Areas A and B present regions in (a) obtained by HR-EBSD. (a, c, e) OIM maps are made in the ND. (b, d, f) grain boundary reconstruction maps. The gray and black lines represent LABs and random boundaries (HABs); the red, yellow, and green lines denote Σ3, Σ9, and Σ27, respectively.

Grahic Jump Location
Figure 2

Grain boundary reconstructions from EBSD mapping for sample A (a), sample B (b), sample C (c), and sample D (d). Thick gray lines denote special boundaries including Σ3, Σ9, and Σ27 boundaries, while black lines denote random HABs or random boundaries.



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In