0
Research Papers

Surface Stress Effect on the Pull-In Instability of Hydrostatically and Electrostatically Actuated Rectangular Nanoplates With Various Edge Supports

[+] Author and Article Information
R. Ansari1

Department of Mechanical Engineering,  University of Guilan, P.O. Box 3756, Rasht, Iranr_ansari@guilan.ac.ir

R. Gholami, M. Faghih Shojaei, V. Mohammadi, M. A. Darabi

Department of Mechanical Engineering,  University of Guilan, P.O. Box 3756, Rasht, Iran

1

Corresponding author.

J. Eng. Mater. Technol 134(4), 041013 (Sep 04, 2012) (10 pages) doi:10.1115/1.4007260 History: Received February 20, 2012; Revised June 07, 2012; Published September 04, 2012; Online September 04, 2012

This paper is aimed to investigate the size-dependent pull-in behavior of hydrostatically and electrostatically actuated rectangular nanoplates including surface stress effects based on a modified continuum model. To this end, based on the Gurtin–Murdoch theory and Hamilton’s principle, the governing equation and corresponding boundary conditions of an actuated nanoplate are derived; the step-by-step linearization scheme and the differential quadrature (GDQ) method are used to discretize the governing equation and associated boundary conditions. The effects of the thickness of the nanoplate, surface elastic modulus and residual surface stress on the pull-in instability of the nanoplate are investigated. Plates made of two different materials including aluminum (Al) and silicon (Si) are selected to explain the variation of the pull-in voltage and pressure with respect to plate thickness.

FIGURES IN THIS ARTICLE
<>
Copyright © 2012 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Schematic of a nanoplate-based NEMS: kinematic parameters, coordinate system, and geometry

Grahic Jump Location
Figure 2

Nondimensional center gap of nanoplates versus nondimensional voltage for different thicknesses of a nanoplate corresponding to four boundary conditions (q0=0)

Grahic Jump Location
Figure 3

Nondimensional center gap of nanoplates versus increase of hydrostatic pressure for different thicknesses of a nanoplate corresponding to four boundary conditions (V¯=4)

Grahic Jump Location
Figure 4

Effect of the surface elastic modulus on the nondimensional center gap of the Si nanoplate under applied voltage (h=2 nm, q0=0, τs=0)

Grahic Jump Location
Figure 5

Effect of the surface elastic modulus on the nondimensional center gap of the Si nanoplate versus hydrostatic pressure (h=2 nm, V¯=4, τs=0)

Grahic Jump Location
Figure 6

Effect of the residual surface stress on the nondimensional center gap of the Si nanoplate under applied voltage (h=2 nm, q0=0, Es=0)

Grahic Jump Location
Figure 7

Nondimensional center gap versus hydrostatic pressure for different residual surface stresses and boundary conditions (h=2 nm, V¯=4, Es=0)

Grahic Jump Location
Figure 8

Nondimensional pull-in voltages of Al and Si nanoplates versus different plate thicknesses with various thicknesses (q0=0)

Grahic Jump Location
Figure 9

Nondimensional pull-in pressures of Al and Si nanoplates versus different plate thicknesses with various thicknesses (V¯=4)

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In