Research Papers

Thermal Stresses in Metallic Materials Due to Extreme Loading Conditions

[+] Author and Article Information
Wojciech Sumelka

e-mail: wojciech.sumelka@put.poznan.pl

Tomasz Łodygowski

e-mail: tomasz.lodygowski@put.poznan.pl
Institute of Structural Engineering,
Poznan University of Technology,
Piotrowo 5 Street,
60-969 Poznań, Poland

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received June 15, 2012; final manuscript received January 8, 2013; published online March 25, 2013. Assoc. Editor: Xi Chen.

J. Eng. Mater. Technol 135(2), 021009 (Mar 25, 2013) (8 pages) Paper No: MATS-12-1145; doi: 10.1115/1.4023777 History: Received June 15, 2012; Revised January 08, 2013

The role of thermal stresses, understood as stresses introduced by a uniform or nonuniform temperature change in a body which is somehow constrained against expansion or contraction, in metallic materials due to extreme loading conditions is under consideration. The thermomechanical couplings (thermal expansion and thermal plastic softening phenomena) have a fundamental impact on damage and localization phenomena due to their influence on the propagation and interaction of the deformation waves. Such processes include strain rates over 107s-1 and temperatures reaching the melting point. It should be emphasized, that apart from thermal effects, the anisotropy of damage (both initial and induced by deformation) plays a central role in the overall process. The aforementioned dynamic events are described in this paper in terms of the Perzyna's type viscoplasticity model recently developed by the authors, including the anisotropic damage. The discussed constitutive structure has a deep physical interpretation derived from the analysis of a single crystal and polycrystal behaviors.

Copyright © 2013 by ASME
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Fig. 1

The comparison of the experimental [9] and numerical results for the strain rate of 3000 s-1 and initial temperature of 296 K

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Fig. 2

The setup for the dynamic test [5]

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Fig. 3

The HMH stress wave (MPa) for the time points: 5, 20, and 250 μs from the left, respectively

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Fig. 4

The temperature evolution (K) for the time points: 20, 130, and 215 μs from the top, respectively (the black arrow indicates the time growth)

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Fig. 5

The near fatigue tip porosity evolution for the time points: 30, 70, and 95 μs from the left, respectively (the black arrow indicates the time growth)

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Fig. 6

The near fatigue tip thermal stress (MPa) evolution for the time points: 45, 100, and 185 μs from the top, respectively




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