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Research Papers

Tension–Torsion Combined Loading Test Equipment for a Minute Beam Specimen

[+] Author and Article Information
Takahiro Namazu

Associate Professor
Division of Mechanical Systems,
Department of Mechanical and Systems Engineering,
University of Hyogo,
2167 Shosha, Himeji,
Hyogo 671-2201, Japan;
PRESTO,
Japan Science and Technology Agency,
4-1-8, Honcho, Kawaguchi,
Saitama 332-0012, Japan
e-mail: namazu@eng.u-hyogo.ac.jp

Shozo Inoue

Division of Mechanical Systems,
Department of Mechanical and Systems Engineering,
University of Hyogo,
2167 Shosha, Himeji, Hyogo 671-2201, Japan

1Corresponding author.

Contributed by the Materials Division of ASME for publication in the Journal of Engineering Materials and Technology. Manuscript received May 9, 2012; final manuscript received October 1, 2012; published online December 21, 2012. Assoc. Editor: Hanchen Huang.

J. Eng. Mater. Technol 135(1), 011004 (Dec 21, 2012) (9 pages) Paper No: MATS-12-1087; doi: 10.1115/1.4007811 History: Received May 09, 2012; Revised October 01, 2012

In this article, the development of quasi-static tension–torsion combined loading test equipment for a microscale beam specimen is described. The equipment is composed of a piezoelectric actuator in actuator case for uniaxial tensile loading, a load cell for measuring X-Y-Z-axes forces and θ-axis torque, a stepping motor for rotating sample stage, X-Y-Z-stages for alignment, and a CCD camera for measuring tensile elongation using original image analysis software. The shape and dimension of all the mechanical jigs were designed by means of finite element analysis (FEA). The tension and torsion loading systems are able to be individually operated, so that uniaxial tension, pure torsion, and combined tension–torsion loadings can be realized. The specimen that was designed in consideration of typical optical microelectromechanical systems (MEMS) devices consists of a mirror plate supported by two microbeam structures, four springs, and a frame with chucking holes. Single crystal silicon (SCS) specimens were fabricated by deep reactive ion etching (DRIE). It was confirmed that the above-described three types of loadings were able to be successfully applied to the beam specimens. All the specimens fractured in a brittle manner and showed different-shape fracture surfaces under different deformation modes.

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References

Niklaus, F., Haasl, S., and Stemme, G., 2003, “Arrays of Monocrystalline Silicon Micromirrors Fabricated Using CMOS Compatible Transfer Bonding,” J. Microelectromech. Syst., 12(4), pp. 465–469. [CrossRef]
Agarwal, R., Samson, S., Kedia, S., and Bhansali, S., 2007, “Fabrication of Integrated Vertical Mirror Surfaces and Transparent Window for Packaging MEMS Devices,” J. Microelectromech. Syst., 16(1), pp. 122–129. [CrossRef]
Namazu, T., Nagai, Y., Naka, N., Araki, N., and Inoue, S., 2012, “Design and Development of a Biaxial Tensile Test Device for a Thin Film Specimen,” Trans. ASME J. Eng. Mater. Technol., 134(1), p. 011009. [CrossRef]
Sharpe, W. N., Jr., Yuan, B., and Edwards, R. L., 1997, “A New Technique for Measuring the Mechanical Properties of Thin Films,” J. Microelectromech. Syst., 6(3), pp. 193–199. [CrossRef]
Tsuchiya, T., Tabata, O., Sakata, J., and Taga, Y., 1998, “Specimen Size Effect on Tensile Strength of Surface-Micromachined Polycrystalline Silicon Thin Films,” J. Microelectromech. Syst., 7(1), pp. 106–113. [CrossRef]
Isono, Y., Namazu, T., and Terayama, N., 2006, “Development of AFM Tensile Test Technique for Evaluating Mechanical Properties of Sub-Micron Thick DLC Films,” J. Microelectromech. Syst., 15(1), pp. 169–180. [CrossRef]
Kamiya, S., Kuypers, J. H., Trautmann, A., Ruther, P., and Paul, O., 2007, “Process Temperature–Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure,” J. Microelectromech. Syst., 16(2), pp. 202–212. [CrossRef]
Gaspar, J., Schmidt, M. E., Held, J., and Paul, O., 2009, “Wafer-Scale Microtensile Testing of Thin Films,” J. Microelectromech. Syst., 18(5), pp. 1062–1076. [CrossRef]
Wonmo, K., Han, J. H., and Saif, M. T. A., 2010, “A Novel Method for In Situ Uniaxial Tests at the Micro/Nanoscale—Part II: Experiment,” J. Microelectromech. Syst., 19(6), pp. 1322–1330. [CrossRef]
Nagai, Y., Namazu, T., Araki, N., Tomizawa, Y., and Inoue, S., 2008, “Development of Bi-Axial Tensile Tester to Investigate Yield Locus for Aluminum Film under Multi-Axial Stresses,” Proceedings of the 21st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2008), Tucson, AZ,, January 13–17, pp. 443–446. [CrossRef]
Kolluri, K., Gungor, M. R., and Maroudas, D., 2009, “Comparative Study of the Mechanical Behavior Under Biaxial Strain of Prestrained Face-Centered Cubic Metallic Ultrathin Films,” Appl. Phys. Lett., 94(10), p. 101911. [CrossRef]
Geandier, G., Thiaudière, D., Randriamazaoro, R. N., Chiron, R., Djaziri, S., Lamongie, B., Diot, Y., Le Bourhis, E., Renault, P. O., Goudeau, P., Bouaffad, A., Castelnau, O., Faurie, D., and Hild, F., 2010, “Development of a Synchrotron Biaxial Tensile Device for In Situ Characterization of Thin Films Mechanical Response,” Rev. Sci. Instrum., 81, p. 103903. [CrossRef] [PubMed]
Wilson, C. J., Ormeggi, A., and Narbutovskih, M., 1996, “Fracture Testing of Silion Microcantilever Beams,” J. Appl. Phys., 79(5), pp. 2386–2393. [CrossRef]
Rua, A., Fernandez, F. E., and Sepulveda, N., 2010, “Bending in VO2-Coated Microcantilever Suitable for Thermally Activated Actuators,” J. Appl. Phys., 107(7), p. 074506. [CrossRef]
Namazu, T., Isono, Y., and Tanaka, T., 2000, “Evaluation of Size Effect on Mechanical Properties of Single Crystal Silicon by Nanoscale Bending Test Using AFM,” J. Microelectromech. Syst., 9(4), pp. 450–459. [CrossRef]
Namazu, T., Isono, Y., and Tanaka, T., 2002, “Plastic Deformation of Nanometric Single Crystal Silicon Wire in AFM Bending Test at Intermediate Temperatures,” J. Microelectromech. Syst., 11(2), pp. 125–135. [CrossRef]
Paulo, A. S., Bokor, J., Howe, R. T., He, R., Yang, P., Gao, D., Carraro, C., and Maboudian, R., 2005, “Mechanical Elasticity of Single and Double Clamped Silicon Nanobeams Fabricated by the Vapor-Liquid-Solid Method,” Appl. Phys. Lett., 87(5), p. 053111. [CrossRef]
Oliver, W. C., and Pharr, G. M., 1992, “An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments,” J. Mater. Res., 7(6), pp. 1564–1583. [CrossRef]
Namazu, T., Maruo, N., and Inoue, S., 2012, “Influences of Film Composition and Annealing on the Mechanical and Electrical Properties of W-Mo Thin Films,” J. Mater. Sci., 47(6), pp. 2725–2730. [CrossRef]
Paul, O., and Gaspar, J., 2008, “Thin-Film Characterization Using the Bulge Test,” Reliability of MEMS (Advanced Micro & Nanosystems), Vol. 6, Chap. 3, Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany, pp. 67–122.
Kim, T., Watanabe, Y., Zhang, S., and Sakane, M., 2011, “Multiaxial Low Cycle Fatigue Life of Mod.9Cr-1Mo Steel Circumferential Notched Specimen Under Nonproportional Loading,” Strength Fract. Complex., 7(2), pp. 147–155. [CrossRef]
Nierenberger, M., Poncelet, M., Pattofatto, S., Hamouche, A., Raka, B., and Virely, J. M., 2012, “Multiaxial Testing of Materials Using a Stewart Platform: Case Study of the Nooru-Mohamed Test,” Exp. Tech. (in press). [CrossRef]
Martins, R., Fortunator, E., Ferreira, I., and Dias, C., 2004, “In-Phase Multiaxial Fatigue Analysis of Tubular AlMgSi Welded Specimens,” Mater. Sci. Forum, 455–456, pp. 303–306. [CrossRef]
Fitzgerald, A. M., Pierce, D. M., Huigens, B. M., and White, C. D., 2009, “A General Methodology to Predict the Reliability of Single-Crystal Silicon MEMS Devices,” J. Microelectromech. Syst., 18(4), pp. 962–970. [CrossRef]
Yamagiwa, H., Fujii, T., Namazu, T., Saito, M., Yamada, K., and Miyatake, T., 2012, “Influences of Specimen Size and Deformation Mode on the Strength of Single-Crystal Silicon Micro-Beam Structures,” Proceedings of the 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS2012), Paris, January 29–February 2, pp. 444–447. [CrossRef]
McSkimin, H. J., 1953, “Measurement of Elastic Constants at Low Temperatures by Means of Ultrasonic Waves Data for Silicon and Germanium Single Crystals, and for Fused Silica,” J. Appl. Phys., 24(8), pp. 988–997. [CrossRef]

Figures

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Fig. 2

Schematic of the test specimen designed in consideration of an optical MEMS mirror device along with the dimensions. The specimen is composed of a mirror plate, two beam specimens, four springs, and a frame with chucking holes.

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Fig. 1

Schematic of pure torsion, uniaxial tension, and tension–torsion combined loading test for investigating the mechanical characteristics of a microscale beam specimen. The three types of the materials test are able to be realized by the combination of uniaxial tension and twisting mechanisms.

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Fig. 9

Representative loading test results showing (a) the tensile force–displacement relation obtained in uniaxial tensile test, (b) the torque-rotation angle relation obtained in pure torsion test, and (c) the relationships between torque, tensile force, and rotation angle obtained in tension–torsion combined loading test

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Fig. 8

Snapshots of sample setting procedure. First, two rhombic-shape chucking holes in both ends of a specimen chip are individually hooked to cylindrical poles on tensile jigs. After the alignment between specimen longitudinal direction and tension direction, those two chucking portions are then fastened mechanically. At the same time, the backside of a mirror plate is supported by a rotation jig. Finally, a rotation chuck jig is fixed to the rotation jig, and the plate is supported from both surface sides.

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Fig. 7

Representative verification test results showing (a) the influence of repulsive force on the actuator displacement, (b) the displacement of actuator case and load cell when a tensile force was applied to a specimen, and (c) the comparison in rotation angle between estimation and experiment

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Fig. 6

Schematic of the mechanical component for rotation loading along with Z displacement distribution in the component calculated by FEA

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Fig. 5

Distributions of X displacement and equivalent stress derived from FEA. The maximum equivalent stress was generated at the curvature portion of spring. The value was 45.5 MPa, which was one-eleventh of the yield stress of A7075T6.

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Fig. 4

The developed tension–torsion combined loading test equipment for a microscale beam specimen. The equipment that includes a piezoelectric actuator, X-Y-Z motor stage, rotation motor stage, X-Y-Z-θ load cell, chucking jig, and CCD camera can be classified broadly into two mechanisms for uniaxial tension test and pure torsion test.

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Fig. 3

Process flow for fabricating the specimen made of SCS along with the photograph of the produced specimen. DRIE was used for the fabrication.

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Fig. 10

SEM photographs of the fracture surface of the specimens after uniaxial tension, pure torsion, and tension–torsion combined loading tests

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