Technical Briefs

Thermomechanical Characterization of Low Density Foams for the ATLAS Upgrade

[+] Author and Article Information
Fiona MacEwan

Physics and Astronomy Department,
Kelvin Building,
University of Glasgow Glasgow,
Scotland, G12 8QQ, UK

Cyrill Locket

Advanced Materials Technology,
Rutherford Appleton Laboratory,
Harwell Oxford Didcot,
OX11 0QX, UK

Contributed by Materials Division of ASME for publication in the Journal of Engineering Materials and Technology. Manuscript received March 15, 2012; final manuscript received January 28, 2013; published online May 6, 2013. Assoc. Editor: Hanchen Huang.

J. Eng. Mater. Technol 135(3), 034501 (May 06, 2013) (3 pages) Paper No: MATS-12-1047; doi: 10.1115/1.4023675 History: Received March 15, 2012; Revised January 28, 2013

The increase of the luminosity of the Large Hadron Collider (LHC) by 2020 requires the upgrade of the ATLAS inner tracker experiment. Expected to be used as support structures in the design of the inner tracker, the thermal and mechanical properties of POCOFOAM and ALLLCOMP foam needed to be well understood and dimensionally stable in order to allow efficient cooling and accurate track reconstruction. Thermal conductivities of these foams were measured experimentally together with the Young's modulus, yield, and shear stresses of POCOFOAM at low stress. Thermomechanical measurements of POCOFOAM were also achieved. This paper describes briefly the measurement systems used and reports the results obtained.

Copyright © 2013 by ASME
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Slack, G. A., 1957, “Effect of Isotopes on Low Temperature Thermal Conductivity”, Phys. Rev., 105(2), pp. 829–831. [CrossRef]
Locatelli, M., Lopez, J., and Numez-Regueiro, M., 1983, “Thermal Radiation Effects in Thermal Conductivity Measurements,” J. Phys. D:Appl. Phys., 16(4), p. 479–487. [CrossRef]
ISO 1827:2007, “Rubber, Vulcanized or Thermoplastic—Dermination of Shear Modulus and Adhesion to Rigid Plates—Quadruple-Shear Methods,” International Organization for Standardization.


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Fig. 1

Overview of the thermal conductivity measurement system

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Fig. 2

Overview of the mechanical jig mounted into a conventional tensile machine

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Fig. 3

Overview of the sandwich

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Fig. 4

View of the thermomechanical measurement system together with the sandwich ready for investigation

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Fig. 5

Results of the in-plane thermal conductivity of the POCOFOAM measurements

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Fig. 6

Results of the in-plane thermal conductivity of the ALLCOMP foam measurements



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