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Research Papers

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

[+] Author and Article Information
Takahiro Namazu

Associate Professor
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
University of Hyogo,
2167 Shosha,
Himeji, Hyogo 671-2201, Japan
e-mail: namazu@eng.u-hyogo.ac.jp

Kohei Ohtani, Shozo Inoue

Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
University of Hyogo,
2167 Shosha,
Himeji, Hyogo 671-2201, Japan

Shugo Miyake

Kobelco Research Institute Inc.,
1-5-5 Takatsukadai,
Nishi-ku, Kobe, Hyogo 651-2271, Japan

1Corresponding author.

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received December 18, 2014; final manuscript received April 4, 2015; published online May 8, 2015. Assoc. Editor: Tetsuya Ohashi.

J. Eng. Mater. Technol 137(3), 031011 (Jul 01, 2015) (7 pages) Paper No: MATS-14-1250; doi: 10.1115/1.4030413 History: Received December 18, 2014; Revised April 04, 2015; Online May 08, 2015

Reactively bonded solder joints with Al/Ni exothermic films attract much attention in semiconductor and microelectromechanical systems (MEMS) industries. Higher bond strength of the joints is required for long-term mechanical reliability. We have investigated the strength of rectangular-solid single crystal silicon (SCS) specimens with reactively bonded Sn-3.5Ag solder joint by using specially developed four-point bending test equipment. In this paper, the influences of Al/Ni exothermic film thickness and metallic interlayer on the strength are discussed. The strength increases with increasing Al/Ni film thickness and pressure load during bonding. Metallic interlayer between the solder and SCS also affects the strength because fracture origin is dependent on the types of metals. The obtained results suggest that reacted NiAl is durable against external forces compared with the solder and interlayer.

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References

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Figures

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Fig. 1

Schematic of process flow for fabricating four-point bending test samples. After fabrication of solder joints using Al/Ni exothermic reaction, rectangular-solid SCS samples with bonded section are produced by blade dicing.

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Fig. 2

Photographs of reactive soldering process using Al/Ni exothermic reaction together with produced test sample

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Fig. 3

Designed and developed four-point bending test equipment for small samples

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Fig. 4

Representative bending force–deflection relation of reactively bonded SCS sample

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Fig. 5

Weibull plot of fracture strength for reactively bonded SCS samples

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Fig. 6

Relationship between pressure load during bonding and scale parameter of Weibull

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Fig. 7

Observation results of fractured samples and the fractured surfaces

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Fig. 8

Representative XRD patterns on fractured surfaces at the top side and base side

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