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Research Papers

Micromechanical Modeling of Viscoplastic Behavior of Laminated Polymer Composites With Thermal Residual Stress Effect

[+] Author and Article Information
Qiang Chen, Zhi Zhai, Xiaojun Zhu, Zhibo Yang

State Key Laboratory for Manufacturing
Systems Engineering,
Xi'an Jiaotong University,
Xi'an, Shaanxi 710049, China

Xuefeng Chen

State Key Laboratory for Manufacturing
Systems Engineering,
Xi'an Jiaotong University,
Xi'an, Shaanxi 710049, China
e-mail: chenxf@mail.xjtu.edu.cn

1Corresponding author.

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received May 8, 2015; final manuscript received March 3, 2016; published online May 10, 2016. Assoc. Editor: Erdogan Madenci.

J. Eng. Mater. Technol 138(3), 031005 (May 10, 2016) (13 pages) Paper No: MATS-15-1114; doi: 10.1115/1.4033070 History: Received May 08, 2015; Revised March 03, 2016

In this paper, a multiscale approach has been developed for investigating the rate-dependent viscoplastic behavior of polymer matrix composites (PMCs) with thermal residual stress effect. The finite-volume direct averaging micromechanics (FVDAM), which effectively predicts nonlinear response of unidirectional fiber reinforced composites, is incorporated with improved Bodner–Partom model to describe the viscoplastic behavior of PMCs. The new micromechanical model is then implemented into the classical laminate theory, enabling efficient and accurate analysis of multidirectional PMCs. The proposed multiscale theory not only predicts effective thermomechanical viscoplastic response of PMCs but also provides local fluctuations of fields within composite microstructures. The deformation behaviors of several unidirectional and multidirectional PMCs with various fiber configurations are extensively simulated at different strain rates, which show a good agreement with the experimental data found from the literature. Influence of thermal residual stress on the viscoplastic behavior of PMCs is closely related to fiber orientation. In addition, the thermal residual stress effect cannot be neglected in order to accurately describe the rate-dependent viscoplastic behavior of PMCs.

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Figures

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Fig. 1

Periodic composites and its RUC

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Fig. 2

Mapping of the reference square subvolume onto a quadrilateral subvolume

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Fig. 3

Transverse thermal response of unidirectional AS4/PEEK PMCs

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Fig. 4

Effective plastic strain distributions within AS4/PEEK system (colorbar scale in%) after cool down temperatures of (a) ΔT=−150 °C, (b) ΔT=−220 °C, and (c)ΔT=−290 °C (figures appear in color in the online version)

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Fig. 5

Effective thermal residual stress distributions within AS4/PEEK system (colorbar scale in MPa) after cool down temperatures of (a) ΔT=−150 °C, (b) ΔT=−220 °C, and (c)ΔT=−290 °C (Figures appear in color in the online version)

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Fig. 6

Stress–strain responses of (a) monolithic PEEK matrix and (b) unidirectional 0 deg AS4/PEEK system at various strain rates. Comparison with experimental data.

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Fig. 7

Thermal residual stress effect on viscoplastic behaviors of off-axis unidirectional AS4/PEEK systems at strain rates of (a) 1 × 10−5/s and (b) 0.1/s. Comparison with experimental data.

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Fig. 8

Thermal residual stress effect on viscoplastic behaviors of (a) 15 deg, (b) 30 deg, (c) 45 deg, (d) 60 deg, (e) 75 deg, and (f) 90 deg AS4/PEEK PMCs at strain rates of 1 × 10−5/s, 0.1/s, and 10/s

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Fig. 9

Effective stress distributions (colorbar scale in MPa) within 90 deg AS4/PEEK system at strain rates of (a) 1 × 10−5/s, (b) 0.1/s, and (c) 10/s (Figures appear in color in the online version)

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Fig. 10

Effective stress distributions (colorbar scale in MPa) within 90 deg AS4/PEEK system at strain rate of 1 × 10−5/s: (a) εxx=1.75% (no thermal), (b) εxx=1.75% (ΔT=−290 °C), (c) εxx=4.0% (no thermal), and (d) εxx=4.0% (ΔT=−290 °C) (Figures appear in color in the online version)

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Fig. 11

Illustration of multiscale FVDAM theory to modeling composite materials and structures

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Fig. 12

A schematic of angle-ply laminate

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Fig. 13

Stress–strain responses for T300/5208 systems with different lay-ups: (a) [0 deg/±45 deg/0 deg]s, (b) [0 deg/±60 deg/0 deg]s, and (c) [90 deg/±45 deg/0]s

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Fig. 14

Stress–strain responses of [±θ]2s AS4/PEEK systems without thermal residual stress effect at strain rate of 0.01/s. Comparison with experimental data.

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Fig. 15

Stress–strain responses of [±θ]2s AS4/PEEK systems with cool down temperature of (a) 290 °C and (b) 150 °C at strain rate of 0.01/s. Comparison with experimental data.

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Fig. 16

Stress–strain responses for (±15 deg)2s and (±30 deg)2s AS4/PEEK with and without thermal residual stress at strain rate of 0.1/s. Comparison with experimental data.

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Fig. 17

Stress–strain responses of [±45 deg]16s and [±60 deg]16s AS4/PEEK systems (a) without thermal residual stress effect and (b) with cool down temperature of 150 °C at strain rate of 1000/s. Comparison with experimental data.

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