Research Papers

Delamination-Based Measurement and Prediction of the Adhesion Energy of Thin Film/Substrate Interfaces

[+] Author and Article Information
Liangliang Zhu

International Center for Applied Mechanics
State Key Laboratory for Strength and
Vibration of Mechanical Structures,
International Center for Applied Mechanics,
School of Aerospace,
Xi'an Jiaotong University,
No. 28, Xianning West Road,
Xi'an, Shaanxi 710049, China;
Columbia Nanomechanics Research Center
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: zhu.liangliang@stu.xjtu.edu.cn

Xi Chen

Fellow ASME
Columbia Nanomechanics Research Center,
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: xichen@columbia.edu

1Corresponding author.

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received August 10, 2016; final manuscript received October 4, 2016; published online February 9, 2017. Assoc. Editor: Taehyo Park.

J. Eng. Mater. Technol 139(2), 021021 (Feb 09, 2017) (4 pages) Paper No: MATS-16-1223; doi: 10.1115/1.4035497 History: Received August 10, 2016; Revised October 04, 2016

With the rapid emerging of two-dimensional (2D) micro/nanomaterials and their applications in flexible electronics and microfabrication, adhesion between thin film and varying substrates is of great significance for fabrication and performance of micro devices and for the understanding of the buckle delamination mechanics. However, the adhesion energy remains to be difficult to be measured, especially for compliant substrates. We propose a simple methodology to deduce the adhesion energy between a thin film and soft substrate based on the successive or simultaneous emergence of wrinkles and delamination. The new metrology does not explicitly require the knowledge of the Young's modulus, Poisson's ratio, and thickness of the 2D material, the accurate measurement of which could be a challenge in many cases. Therefore, the uncertainty of the results of the current method is notably reduced. Besides, for cases where the delamination width is close to the critical wrinkle wavelength of the thin film/substrate system, the procedure can be further simplified. The simple and experimentally easy methodology developed here is promising for determining/estimating the interface adhesion energy of a variety of thin film/soft substrate systems.

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Grahic Jump Location
Fig. 1

Schematic diagram of substrate compression induced wrinkles (a) and delamination (b). Definition of the wrinkle amplitude A and wavelength λw, and delamination height δ and width λd are indicated. Wrinkles and delamination are not drawn to scale.




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