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Research Papers

Microstructure and Texture Development in Alpha-Brass Using Repetitive Thermomechanical Processing

[+] Author and Article Information
Khaled Al-Fadhalah

Department of Mechanical Engineering,
College of Engineering and Petroleum,
Kuwait University,
P.O. Box 5969,
Safat 13060, Kuwait
e-mail: khaled.alfadhalah@ku.edu.kw

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received December 15, 2016; final manuscript received November 3, 2017; published online January 19, 2018. Assoc. Editor: Marwan K. Khraisheh.

J. Eng. Mater. Technol 140(2), 021007 (Jan 19, 2018) (9 pages) Paper No: MATS-16-1374; doi: 10.1115/1.4038674 History: Received December 15, 2016; Revised November 03, 2017

Repetitive thermomechanical processing (TMP) has been applied to evaluate the effect of compression strain and temperature on microstructure and texture development in an alpha-brass alloy. Two TMP schemes were employed using four cycles of low-strain compression (ε = 0.15) and annealing, and two cycles of medium-strain compression (ε = 0.3) and annealing. Compression tests were conducted at 25, 250, and −100 °C, while annealing was made at 670 °C for 10 min. Examination by electron backscattered diffraction (EBSD) indicated that the low-strain scheme was capable to increase the fraction of Σ3n boundaries (n = 1, 2, and 3) with increasing cycles, producing maximum fraction of 68%. For medium-strain scheme, a drop in the fraction of Σ3n boundaries occurred in cycle 2. Reducing compression temperature lowered the fraction of Σ3n boundaries for low-strain scheme, while it enhanced the formation of Σ3n boundaries for medium-strain scheme. Annealing textures showed that 〈101〉 compression fiber was strongly retained for samples processed by small-strain scheme, while weakening of 〈101〉 fiber accompanied by the formation of 〈111〉 recrystallization fiber occurred for the medium-strain scheme. The results indicate that the increase in strain energy stored during compression, via increasing strain and/or decreasing deformation temperature, is responsible to favor recrystallization twinning over strain-induced grain boundary migration (SIBM). Both mechanisms are important for the formation of Σ3n boundaries. Yet, SIBM is thought to strongly promote regeneration of Σ3n boundaries at higher TMP cycles. This is consistent with the development of microstructure and texture using small-strain scheme.

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Figures

Grahic Jump Location
Fig. 1

Grain boundary reconstruction from EBSD mapping for brass sample in as-received condition. Black lines denote random HAGBs, while red, yellow, and green lines represent Σ3, Σ9, and Σ27 boundaries, respectively.

Grahic Jump Location
Fig. 2

Grain boundary reconstruction from EBSD mapping for brass samples processed by four-cycle scheme. Compression was made at (a)–(d) 25 °C, (e)–(h) 250 °C, and (i)–(l) −100 °C. Black lines denote random HAGBs, while red, yellow, and green lines represent Σ3, Σ9, and Σ27 boundaries, respectively.

Grahic Jump Location
Fig. 3

Grain boundary reconstruction from EBSD mapping for brass samples processed by two-cycle scheme. Compression was made at (a) and (b) 25 °C, (c) and (d) 250 °C, and (e) and (f) −100 °C. Black lines denote random HAGBs, while red, yellow, and green lines represent Σ3, Σ9, and Σ27 boundaries, respectively.

Grahic Jump Location
Fig. 4

IPFs along compression axes for annealing and compression textures of brass: (a) and (b) Ref. [17] and (c) and (d) this work

Grahic Jump Location
Fig. 5

IPFs of annealing texture for brass samples subjected to four-cycle scheme

Grahic Jump Location
Fig. 6

IPFs of annealing texture for brass samples subjected to two-cycle scheme

Grahic Jump Location
Fig. 7

Strain contouring maps presenting brass samples subjected to four-cycle scheme using compression temperature of 25 °C and 250 °C

Grahic Jump Location
Fig. 8

IPFs of compression texture for brass samples processed by four-cycle scheme. Compression was made at (a)–(d) 25 °C and (e)–(h) 250 °C.

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