Spectrum Crack Growth in Adhesively Bonded Structure

[+] Author and Article Information
W. S. Johnson, W. C. Rister, T. Spamer

Fatigue and Fracture Group, General Dynamics, Fort Worth, Texas

J. Eng. Mater. Technol 100(1), 57-63 (Jan 01, 1978) (7 pages) doi:10.1115/1.3443451 History: Received April 01, 1977; Revised July 22, 1977; Online August 17, 2010


A method is presented by which crack growth of damage tolerance type flaws can be predicted in adhesively bonded structure subjected to spectrum loading. The method accounts for a laminate stress intensity correction factor, induced bending and axial load transfer between plies, as well as a crack growth analysis procedure to predict the crack growth retardation behavior under spectrum load. Analytical predictions are compared to several test results to show the applicability of the prediction method presented.

Copyright © 1978 by ASME
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