Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

[+] Author and Article Information
R. W. Rohde

Sandia Laboratories, Albuquerque, N.M. 87185

J. C. Swearengen

Sandia Laboratories, Livermore, Calif.

J. Eng. Mater. Technol 102(2), 207-214 (Apr 01, 1980) (8 pages) doi:10.1115/1.3224799 History: Received March 26, 1979; Revised October 16, 1979; Online September 15, 2009


Stress relaxation of four solder alloys, 50 percent Pb-50 percent In; 37.5 percent Sn-37.5 percent Pb-25 percent In; 63 percent Sn-37 percent Pb; and 62.5 percent Sn-37 percent Pb-0.5 percent Ag, has been examined at 222 K, 298 K, and 344 K. A model previously utilized to describe inelastic deformation of aluminum and stainless steels is applied and found to provide an excellent description of the experimental data. This model is based upon the general concept of stress assisted thermally activated dislocation glide in a microstructure evolving by the process of strain hardening and recovery. Model parameters useful for calculations of time dependent behavior of these solders are presented and their significance is discussed.

Copyright © 1980 by ASME
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