Simulation of Surface Grinding

[+] Author and Article Information
Y. Y. Li, Y. Chen

Department of Mechanics and Materials Science, Rutgers, The State University of New Jersey, Piscataway, NJ 08855-0909

J. Eng. Mater. Technol 111(1), 46-53 (Jan 01, 1989) (8 pages) doi:10.1115/1.3226432 History: Received November 24, 1987; Online September 15, 2009


The objective in this research is to develop a mathematical model which simulates the grinding process and predicts the transient temperature field and the stresses generated in the workpiece due to the forces applied and the heat produced by the grinding wheel. It also predicts the residual stress and the microstructure. The model considers the fully coupled thermomechanical field equations, with coupling through the dilatational work, the plastic work, the heat release during phase transformation and the heat generated by the grinding wheel in the energy equation. Computations were performed for a workpiece in plane strain. The model calculates the temperature, stress, microstructure fields and elastic/plastic regions of the workpiece during grinding. Different downfeeds of the grinding wheel were considered. The results show a good qualitative agreement with experiment.

Copyright © 1989 by ASME
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