High Temperature Fracture Toughness in Silicon Nitride and Sialon

[+] Author and Article Information
Y. Mutoh, N. Miyahara, K. Yamaishi

Nagaoka University of Technology, Nagaoka-shi 940-21 Japan

T. Oikawa

NKK Corp., Kawasaki-ku, Kawasaki-shi 210 Japan

J. Eng. Mater. Technol 115(3), 268-272 (Jul 01, 1993) (5 pages) doi:10.1115/1.2904217 History: Received April 15, 1992; Revised December 01, 1992; Online April 29, 2008


Fracture Toughness of HIP-sintered silicon nitride decreased with increasing temperature up to 1200°C. The brittle-to-ductile transition was observed in the temperature range from 1200°C to 1275°C: the fracture toughness rapidly increased in the transition region. Above the transition temperature, the fracture toughness decreased with increasing temperature. Fracture toughness of sialon increased with increasing temperature. Transition of fracture mechanism was observed in sialon around 1300°C. The differences of temperature dependence of fracture toughness between two materials are interpreted in terms of the effects of grain-boundary glass phase on fracture.

Copyright © 1993 by The American Society of Mechanical Engineers
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