Laminate Delamination Due to Thermal Gradients

[+] Author and Article Information
J. W. Hutchinson, T. J. Lu

Division of Applied Sciences, Harvard University, Cambridge, MA 02138

J. Eng. Mater. Technol 117(4), 386-390 (Oct 01, 1995) (5 pages) doi:10.1115/1.2804730 History: Received May 05, 1995; Online November 27, 2007


Flaw-induced delamination of orthotropic laminates subject to through-thickness temperature gradients is analyzed. A crack-like flaw impedes heat flow through the laminate, producing thermal stresses and crack tip stress intensities. The focus is on delamination cracks which propagate under steady-state conditions. The steady-state analysis becomes accurate for a crack whose length is about one laminate thickness. Moreover, the analysis provides realistic fail-safe criteria for excluding delamination.

Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In