Thermal Shock Strength of a Semi-infinite Piezoelectric Medium

[+] Author and Article Information
Bao-Lin Wang, Yu-Guo Sun

School of Aerospace, Mechanical and Mechatronic Engineering J11, The University of Sydney, Sydney, NSW 2006, Australiae-mail: wangbl2001@hotmail.com

J. Eng. Mater. Technol 126(4), 450-456 (Nov 09, 2004) (7 pages) doi:10.1115/1.1789964 History: Received October 07, 2003; Revised February 21, 2004; Online November 09, 2004
Copyright © 2004 by ASME
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Zhang,  T. Y., Zhao,  M. H., and Tong,  P., 2002, “Fracture of Piezoelectric Ceramics,” Adv. Appl. Mech., 38, pp. 147–289.
Ashida,  F., Tauchert,  T. R., and Noda,  N., 1993, “Response of a Piezothermoelastic Plate of Crystal Class 6 mm subject to axisymmetric heating,” Int. J. Eng. Sci., 31, pp. 373–384.
Chandrasekharaiah,  D. S., 1988, “A Generalized Linear Thermoelasticity Theory for Piezoelectric Media,” Acta Mech., 71, 39–49.
Choi,  J., Ashida,  F., and Noda,  N., 1995, “Transient Piezothermoelasticity of a Hexagonal Plate of Class 6 mm,” Arch. Appl. Mech., 65, pp. 24–37.
Ding,  H., Guo,  F., and Hou,  P., 2000, “A General Solution for Piezothermoelasticity of Transversely Isotropic Piezoelectric Materials and its Applications,” Int. J. Eng. Sci., 38, pp. 1415–1440.
Dunn,  M. L., 1993, “Micromechanics of Coupled Electroelastic Composites: Effective Thermal Expansion and Pyroelectric Coefficients,” J. Appl. Phys., 73, pp. 5131–5140.
Erdogan,  F., and Wu,  B. H., 1996, “Crack Problem in FGM Layers Under Thermal Stresses,” J. Therm. Stresses, 19, pp. 237–265.
Lee,  H., and Saravanos,  D. A., 2000, “A Mixed Multi-field Finite Element Formulation for Thermopiezoelectric Composite Shells,” Int. J. Solids Struct., 37, pp. 4949–4967.
Levin,  V. M., Rakovskaja,  M. I., and Kreher,  W. S., 1999, “The Effective Thermoelectroelastic Properties of Microinhomogeneous Materials,” Int. J. Solids Struct., 36, pp. 2683–2705.
Ootao,  Y., and Tanigawa,  Y., 2000, “Three-dimensional Transient Piezothermoelasticity in Functionally Graded Rectangular Plate Bonded to a Piezoelectric Plate,” Int. J. Solids Struct., 37, pp. 4377–4401.
Tauchert,  T. R., 1992, “Piezothermoelastic Behavior of the Laminated Plate,” J. Therm. Stresses, 15, pp. 25–37.
Vel,  S. S., and Batra,  R. C., 2003, “Generalized Plane Strain Thermopiezoelectric Analysis of Multilayered Plates,” J. Therm. Stresses, 26(4), pp. 353–377.
Qin,  Q. H., 2000, “General Solutions for Thermopiezoelectrics With Various Holes Under Thermal Loading,” Int. J. Solids Struct., 37, pp. 5561–5578.
Qin,  Q., and Mai,  Y., 1999, “A Closed Crack Tip Model for Interface Cracks in Thermopiezoelectric Materials,” Int. J. Solids Struct., 36, pp. 2463–2479.
Lu,  P., Tan,  M. J., and Liew,  K. M., 1998, “Piezothermoelastic Analysis of a Piezoelectric Material With an Elliptic Cavity Under Uniform Heat Flow,” Arch. Appl. Mech., 68, pp. 719–733.
Niraula,  O. P., and Noda,  N., 2002, “Thermal Stress Analysis in Thermopiezoelastic Strip With an Edge Crack,” J. Therm. Stresses, 25(4), pp. 389–405.
Ueda,  S., 2003, “Thermally-induced Fracture of a Piezoelectric Laminate With a Crack Normal to Interfaces,” J. Therm. Stresses, 26(4), pp. 311–331.
Wang,  B. L., and Mai,  Y. W., 2002, “A Cracked Piezoelectric Material Strip Under Transient Thermal Loading,” ASME J. Appl. Mech., 69(4), pp. 539–546.


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A semi-infinite piezoelectric medium with a surface electrically conducting crack
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Variation of the thermal stress σyy(x,t) and electric field Ex(x,t) with time at selected positions (σ0=−λ̃11T0,E0=β̃3T0)
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Variation of the stress-intensity factor K1 with time at selected crack lengths (σ0=−λ̃11T0)
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Variation of the electric-field intensity factor KE with time at selected crack lengths (E0=β̃3T0)
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Normalized stress and electric field intensity factors with normalized time
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Variation of thermal stress intensity factors with crack lengths (σ0=−λ̃11T0)
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Crack-growth trajectory (c0=0.1 mm,σ0=−λ̃11T0)
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Thermal shock resistance curve (c is the crack depth of the surface crack. Stress-based failure for crack lengths smaller than ct, and fracture-based failure for crack lengths larger than ct)



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