Research Papers

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

[+] Author and Article Information
Shugo Miyake

Department of Mechanical Engineering,
Kobe City College of Technology,
Kobe 651-2194, Japan
e-mail: miyake@kobe-kosen.ac.jp

Kohei Ohtani, Shozo Inoue, Takahiro Namazu

Department of Mechanical Engineering,
University of Hyogo,
Himeji 671-2201, Japan

Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received June 6, 2015; final manuscript received November 11, 2015; published online December 8, 2015. Assoc. Editor: Tetsuya Ohashi.

J. Eng. Mater. Technol 138(1), 011006 (Dec 08, 2015) (7 pages) Paper No: MATS-15-1128; doi: 10.1115/1.4032020 History: Received June 06, 2015; Revised November 11, 2015

Self-propagating exothermic reaction bonding (SERB) technique with Al/Ni multilayer film is fascinating in the viewpoint of lots of outstanding features, such as atmosphere-independent exothermic reaction and its self-propagation. The reactively bonded solder joints with high bonded strength are required for practical use in semiconductor devices. We have investigated the fracture strength of rectangular-solid specimens with reactively bonded solder joint (Sn–3.5Ag solder/reacted NiAl/Sn–3.5Ag solder) sandwiched by single crystal silicon (SCS). In this paper, the influence of bonding atmosphere on the fracture behavior is discussed by means of four-point bending testing and fracture surface observation. The fracture strength increases with increasing pressure load during bonding. The strength of the vacuum-bonded specimens is found to be higher than that of the air-bonded specimens. The fracture surface observation results suggest that Al oxide and intermetallic compounds (IMCs) formed at the reacted NiAl layer and the SnAg solder layer, respectively, would have affected the strength of the Al/Ni SERB joints.

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Fig. 1

Schematic of self-propagating exothermic reaction in an Al/Ni multilayer film

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Fig. 2

Schematic of process flow for fabricating the Al/Ni SERB specimens for four-point bending testing: (a) film deposition, (b) reactive bonding, (c) dicing, and (d) specimen

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Fig. 3

Specially developed four-point bending test equipment for small specimens

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Fig. 4

Photographs of unpolished and polished specimens for four-point bending test

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Fig. 6

Weibull plot of fracture strength for the Al/Ni SERB specimens

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Fig. 5

Representative bending stress–deflection curves of the Al/Ni SERB specimens

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Fig. 9

Comparison of fracture surface for strong specimen with that for weak specimen bonded at 5 MPa in air

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Fig. 8

Fractured surface observation results of the Al/Ni SERB specimens shot with CCD camera and scanning electron microscope (SEM)

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Fig. 7

Relationship between pressure load during bonding and scale parameter of Weibull



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