Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work that the J-integral with a special flat rectangular contour near the crack tip can be used as energy release rate at the interface between chip and underfill. Meanwhile, the delamination propagation rates at the interface was measured by using C-mode scanning acoustic microscope (C-SAM) inspection for two types of flip chip packages under thermal cycle loading. Finally, the half-empirical Paris equation, which can be used as a design base of delamination reliability in flip chip package, has been determined from the crack propagation rates measured and the energy release rates simulated.

Issue Section:
Technical Papers
Keywords:
cracks, inspection, failure analysis, chip-on-board packaging, flip-chip devices, fracture mechanics, delamination, acoustic microscopy, finite element analysis, J-integral, Flip-chip, Interfacial delamination, Crack propagation, Finite element simulation
Topics:
Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles, Reliability
1.
Suhir
,
E.
,
1998
, “
The Future of Microelectronic and Photonics and the Role of Mechanics and Materials
,”
ASME J. Electron. Packag.
,
120
, pp.
1
–
11
.
2.
Suryanarayana
,
D.
,
Hsiao
,
R.
,
Gall
,
T. P.
, and
McCreary
,
J. M.
,
1991
, “
Enhancement of Flip Chip Fatigue Life by Encapsulation
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
14
, pp.
218
–
223
.
3.
Lau
,
J. H.
,
1996
, “
Solder Joints Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical and Vibrational Conditions
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
,
19
, pp.
728
–
735
.
4.
Gektin
,
V.
,
Bar-Cohen
,
A.
, and
Ames
,
J.
,
1997
, “
Coffin-Manson Fatigue Model of Underfilled Flip-Chip
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
,
20
,
Sept.
, pp.
317
–
325
.
5.
Nakano, F. et al., 1987, “Resin Insertion Effect on Thermal Cycle Resistively of Flip Chip Mounted LSI Devise,” Proceedings 1987 ISHM Conference, pp. 536–541.
6.
Tsukada, Y., l994, “Solder Bumped Flip Chip Attach on SLC Board and Multi-Chip Module,” Chips on Board Technologies for Multi-chip Modules, J. H. Lan, ed., New York, Van Nostrand Reinhold, pp. 410–443.
7.
Gurumurthy
,
C. K.
,
Jiao
,
J.
,
Norris
,
L. G.
,
Hui
,
C. Y.
, and
Kramer
,
E. J.
,
1998
, “
A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
,”
ASME J. Electron. Packag.
,
120
, pp.
372
–
378
.
8.
Kook
,
S.-Y.
,
Snodgrass
,
J. M.
,
Kirtikar
,
A.
, and
Dauskardt
,
R. H.
,
1998
, “
Adhesion and Reliability of Polymer/Inorganic Interfaces
,”
ASME J. Electron. Packag.
,
120
, pp.
328
–
335
.
9.
Wang
,
Jianjun
,
Lu
,
Minfu
,
Zou
,
Daqing
, and
Liu
,
Sheng
,
1998
, “
Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part B
,
21
(
1
), pp.
79
–
85
.
10.
Wang
,
Jianjun
,
Zou
,
Daqing
,
Lu
,
Minfu
,
Ren
,
Wen
, and
Liu
,
Sheng
,
1999
, “
Evaluation of Interfacial Fracture Toughness of a Flip-Chip Package and a Bimaterial System by a Combined Experimental and Numerical Method
,”
Eng. Fract. Mech.
,
64
, pp.
781
–
795
.
11.
Yao
,
Qizhou
,
Qu
,
Jianmin
,
Wu
,
Jiali
, and
Wong
,
C. P.
,
1999
,
IEEE Trans. Electronic Packaging Manufact.
,
22
(
4
), pp.
264
–
267
.
12.
Lau
,
John H.
,
Ricky
,
S.-W.
,
Ricky
,
S.-W.
, and
Chang
,
Chis
,
2000
, “
Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board With Imperfect Underfill Encapsulants
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part B
,
23
(
2
), pp.
323
–
332
.
13.
Zhang
,
Q.
,
Xie
,
X. M.
,
Chen
,
L.
,
Wang
,
G. Z.
,
Cheng
,
Z. N.
, and
Kempe
,
W.
,
2000
, “
On the Degradation of the Solder Joints of Underfilled Flip Chip Packages: A Case Study
,”
Soldering & Surface Mount Technology
,
12
(
3
), pp.
24
–
28
.
14.
Chen
,
L.
,
Zhang
,
Q.
,
Wang
,
G. Z.
,
Xie
,
X. M.
, and
Cheng
,
Z. N.
,
2001
, “
The Effects of Underfill and Its Material Models on Thermomechanical Behaviors of Flip Chip Package
,”
IEEE Trans.
,
24
(
1
), pp.
17
–
24
.
15.
Cheng
,
Z. N.
,
Wang
,
G. Z.
,
Chen
,
L.
,
Wilde
,
J.
, and
Becker
,
K.
,
2000
, “
Viscoplastic Anand Model for Tin-Lead Based Solders and Its Application
,”
Soldering & Surface Mount Technology, J. of SMART
,
12
(
2
), pp.
31
–
36
.
16.
Wilde, J., Cheng, Z. N., and Wang, G. Z., 1999, “Influences of Packaging Materials on Solder Joint Reliability of Chip Scale Package Assemblies,” Proc. 1999 Int. Symp. Adv. Packag. Mater., Braselton, GA, Mar. 14–17, pp. 144–149.
17.
Rice
,
J. R.
, and
Sih
,
G. C.
,
1965
, “
A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks
,”
ASME J. Appl. Mech.
,
35
, pp.
379
–
386
.
18.
Weichen
,
Shi
, and
Bangkuang
,
Zhen
,
1999
, “
J-Integal of Dissimilar Anisotropic Media
,”
Int. J. Fract.
,
96
, pp.
37
–
42
.
19.
Suo
,
Z.
,
1990
, “
Singularities, Interfaces and Cracks in Dissimilar Anisotropic Media
,”
Proc. R. Soc. London, Ser. A
,
427
, pp.
331
–
358
.
Copyright © 2004
 by ASME
You do not currently have access to this content.