The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions: , , and , subjected to two test conditions consisting of different average current densities and ambient temperatures ( at and at ). It is interesting to realize that as the Cu weight content of the solder composition increases, the fatigue life increases under at but decreases under at . Observed electromigration morphologies along with computed current density and temperature distributions on solder interconnects from the electrothermal coupling analysis were examined, correlated, and discussed.
Issue Section:
Research Papers
Keywords:
flip-chip devices,
electromigration,
solders,
integrated circuit interconnections,
life testing,
fatigue testing,
reliability,
temperature distribution,
tin alloys,
copper alloys,
silver alloys,
current density,
electromigration,
solder bump,
flip-chip,
reliability,
electrothermal coupling analysis
1.
Tu
, K. N.
, 2003, “Recent Advances on Electro-Migration in Very-Large-Scale-Integration of Interconnects
,” J. Appl. Phys.
0021-8979, 94
(9
), pp. 5451
–5473
.2.
Choi
, W. J.
, Yeh
, E. C. C.
and Tu
, K. N.
, 2003, “Mean-Time-to-Failure Study of Flip Chip Solder Joints on Cu∕Ni(V)∕Al Thin-Film Under-Bump-Metallization
,” J. Appl. Phys.
0021-8979, 94
(9
), pp. 5665
–5671
.3.
Nah
, J. W.
, Paik
, K. W.
, Suh
, J. O.
, and Tu
, K. N.
, 2003, “Mechanism of Electromigration-Induced Failure in the 97Pb-3Sn and 37Pb-63Sn Composite Solder Joints
,” J. Appl. Phys.
0021-8979, 94
(12
), pp. 7560
–7566
.4.
Zheng
, P.-J.
, Hung
, C.-Y.
, Lee
, Z.-J.
, Lee
, C.-W.
, Chung
, C.-S.
, and Wu
, J.-D.
, 2003, “A Comparison of Electromigration and Thermal Fatigue Performance Between Thin and Thick Film UBM
,” Proceedings 36th International Symposium on Microelectronics
, Boston, MA, pp. 93
–99
.5.
Rinne
, G. A.
, 2003, “Issues in Accelerated Electromigration of Solder Bumps
,” Microelectron. Reliab.
0026-2714, 43
(12
), pp. 1975
–1980
.6.
Shao
, T. L.
, Chen
, Y. H.
, Chiu
, S. H.
, and Chen
, C.
, 2004, “Electromigration Failure Mechanisms for SnAg3.5 Solder Bumps on Ti∕Cr−Cu∕Cu and Ni(P)∕Au Metallization Pads
,” J. Appl. Phys.
0021-8979, 96
(8
), pp. 4518
–4524
.7.
Lai
, Y.-S.
, Lee
, C.-W.
, Shao
, Y.-H.
, and Liu
, Y.-H.
, 2004, “Electromigration of Sn‐Pb‐Ni and Sn-Pb-Cu Solder Bumps in Flip-Chip Packages
,” Proceedings 6th International Conference on Electronics Materials and Packaging
, Penang, Malaysia, pp. 314
–319
.8.
Wu
, J.-D.
, Zheng
, P.-J.
, Lee
, C.-W.
, Hung
, S.-C.
, and Lee
, J.-J.
, 2006, “A Study in Flip-Chip UBM/Bump Reliability With Effects of SnPb Solder Composition
,” Microelectron. Reliab.
0026-2714, 46
(1
), pp. 41
–52
.9.
Lai
, Y.-S.
, and Kao
, C.-L.
, 2006, “Electrothermal Coupling Analysis of Current Crowding and Joule Heating in Flip–Chip Packages
,” Microelectron. Reliab.
0026-2714, 46
(8
), pp. 1357
–1368
.10.
Lai
, Y.-S.
, and Kao
, C.-L.
, 2006, “Characteristics of Current Crowding in Flip-Chip Solder Bumps
,” Microelectron. Reliab.
0026-2714, 46
(5–6
), pp. 915
–922
.11.
Shaukatullah
, H.
, Gaynes
, M. A.
, and White
, L. H.
, 1994, “A Non-Dimensional Correlation for the External Thermal Characteristics of Surface Mount Metal Quad Flat Packs
,” Proceedings 1994 Intersociety Conference on Thermal Phenomena in Electronic Systems
, Washington, DC, pp. 237
–244
.12.
Guenin
, B. M.
, Marrs
, R. C.
, and Molnar
, R. J.
, 1995, “Analysis of a Thermally Enhanced Ball Grid Array Package
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886, 18
(4
), pp. 749
–757
.13.
Zahn
, B. A.
, and Stout
, R. P.
, 1997, “Evaluation of Isothermal and Isoflux Natural Convection Coefficient Correlations for Utilization in Electronic Package Level Thermal Analysis
,” Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
, Austin, TX, pp. 24
–31
.14.
Ellison
, G. N.
, 1989, Thermal Computations for Electronic Equipment
, R. E. Krieger
, Malabar.15.
Lai
, Y.-S.
, Sathe
, S.
, Kao
, C.-L.
, and Lee
, C.-W.
, 2005, “Integrating Electrothermal Coupling Analysis in the Calibration of Experimental Electromigration Reliability of Flip-Chip Packages
,” Proceedings 55th Electronic Components and Technology Conference
, Lake Buena Vista, FL, pp. 1421
–1426
.16.
Lai
, Y.-S.
, and Kao
, C.-L.
, 2006, “Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis
,” J. Electron. Mater.
0361-5235, 35
(5
), pp. 972
–977
.17.
Ye
, H.
, Basaran
, C.
, and Hopkins
, D. C.
, 2003, “Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing
,” Appl. Phys. Lett.
0003-6951, 82
(7
), pp. 1045
–1047
.18.
Huang
, A. T.
, Gusak
, A. M.
, Tu
, K. N.
, and Lai
, Y.-S.
, 2006, “Thermomigration in SnPb Composite Flip Chip Solder Joints
,” Appl. Phys. Lett.
0003-6951, 88
, 141911
.19.
Lee
, H.-T.
, Chen
, M.-H.
, Jao
, H.-M.
, and Hsu
, C.-J.
, 2004, “Effect of Adding Sb on Microstructure and Adhesive Strength of Sn-Ag Solder Joints
,” J. Electron. Mater.
0361-5235, 33
(9
), pp. 1048
–1054
.20.
Du
, M.-Y.
, Chen
, C.-M.
, and Chen
, S.-W.
, 2003, “Effects Upon Interfacial Reactions by Electric Currents of Reversing Directions
,” Mater. Chem. Phys.
0254-0584, 82
(3
), pp. 818
–825
.Copyright © 2007
by American Society of Mechanical Engineers
You do not currently have access to this content.
