Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid-dynamic software. In this study, a modified-graphical method (MGM) based on a previous study by Lineykin and Ben-Yaakov is proposed to analyze an active cooling system using thermoelectric modules. The MGM provides quicker visualization of the cooling requirement such as the optimum operating currents, temperature of the hot side, and coefficient of performance without the need of using any manufacturer’s proprietary data. In addition, the MGM is designed to analyze a multidimensional-heat-transfer-system utilizing thermoelectric modules (Phan, H., and Agonafer, D., 2010, “Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132(2), p. 024501).

Issue Section:
Research Papers
Keywords:
cooling, graphs, integrated circuit packaging, thermoelectricity, Thermoelectric cooler, design, COP, performance, 3D TEC system analysis
Topics:
Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software, Visualization

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 by American Society of Mechanical Engineers
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