graphic
View largeDownload slide
Issue Section:
Research Papers
Topics:
Bridges (Structures), Glass, Integrated circuits, Optics, Switches

Abstract

The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.

Issue Section:
Research Papers
Topics:
Bridges (Structures), Glass, Integrated circuits, Optics, Switches

References

1.
Chai
,
Y.
,
Lau
,
J. H.
, Ramana, P. V., Yap, G. J., and Lau, J. H.-S.,
2008
, “
Development of a Low Cost 2.5 Gbps SFP Optical Transceiver Using 0.18 μm CMOS ICs
,”
Proc. SPIE
,
6899
, pp.
0 U.1
–
0 U.9
.10.1117/12.764294
2.
Lau
,
J. H.
,
Erasmus
,
S.
,
Sporon-Fiedler
,
F.
,
Murphy
,
S.
,
Herms
,
R.
, and
Pan
,
S.
,
2001
, “
Creep Analysis of a Fiber-Optic Transceiver Housing
,”
ASME
Paper No. 15868.
3.
Lau
,
J. H.
,
Erasmus
,
S.
,
Sporon-Fiedler
,
F.
, and
Chang
,
C.
,
2001
, “
DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications
,”
ASME
Paper No. IMECE 2001/EPP-24720.10.1115/IMECE2001/EPP-24720
4.
Lau
,
J. H.
,
Jiaa
,
C. L.
, and
Erasmus
,
S.
,
2001
, “
Corrosion Analysis of a Fiber-Optic Transceiver Housing
,”
ASME
Paper No. IMECE 2001/EPP-24721.10.1115/IMECE2001/EPP-24721
5.
Lau
,
J. H.
,
Jiaa
,
C. L.
, and
Erasmus
,
S. J.
,
2002
, “
Corrosion Analysis of a Fiber-Optic Transceivers Housing
,”
ASME J. Electron. Packag.
,
124
(
4
), pp.
379
–
384
.10.1115/1.1510862
Google Scholar
Crossref
Search ADS
 
6.
Takemura
,
K.
,
Ohshima
,
D.
,
Noriki
,
A.
,
Okamoto
,
D.
,
Ukita
,
A.
,
Ushida
,
J.
,
Tokushima
,
M.
, et al.,
2022
, “
Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform
,”
Trans. Jpn. Inst. Electron. Packag.
,
15
, pp.
E21-012-1
–
E21-012-13
.10.5104/jiepeng.15.E21-012-1
Google Scholar
Crossref
Search ADS
 
7.
Ackermann
,
M.
,
Shen
,
B.
,
Merget
,
F.
,
Wolz
,
M.
, and
Witzens
,
J.
,
2022
, “
Glass-Molded Optical Interposers for Wafer Scale Photonic Integrated Circuit Packaging in 800G Modules and Co-Packaged Optics
,”
Proc. SPIE
,
12007
, p.
120070M
.10.1117/12.2608205
8.
Lee
,
B.
,
Nedovic
,
N.
,
Greer
,
T.
, III. , and
Thomas Gray
,
C.
,
2023
, “
Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon Interposer
,”
J. Lightwave Technol.
,
41
(
4
), pp.
1152
–
1162
.10.1109/JLT.2022.3219379
Google Scholar
Crossref
Search ADS
 
9.
Brusberg
,
L.
,
Zakharian
,
A. R.
,
Grenier
,
J. R.
,
Paddock
,
B. J.
,
Levesque
,
D. W.
,
Sutton
,
C. G.
, and
Force
,
R. M.
, et al.,
2022
, “
Glass Substrate for Co-Packaged Optics
,”
Proceedings of IMAPS 55th International Symposium on Microelectronics
, Boston, MA, Oct. 3–6, pp.
236
–
241
.https://imapsource.org/article/74749.pdf
Google Scholar
Crossref
Search ADS
 
10.
Noriki
,
A.
,
Ukita
,
A.
,
Takemura
,
K.
,
Suda
,
S.
,
Kurosu
,
T.
,
Ibusuki
,
Y.
,
Tamai
,
I.
, et al.,
2023
, “
Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics
,”
J. Lightwave Technol.
,
41
(
15
), pp.
5078
–
5083
.10.1109/JLT.2023.3283988
Google Scholar
Crossref
Search ADS
 
11.
Brusberg
,
L.
,
Grenier
,
J.
,
Kocabaş
,
Ş.
,
Zakharian
,
A.
,
Yeary
,
L.
,
Levesque
,
D.
, and
Paddock
,
B.
, et al.,
2022
, “
Glass Interposer for High-Density Photonic Packaging
,”
Proceedings of OFC (Optical Fiber Communication)
, San Diego, CA, Mar. 6–10, p.
Tu3A.3
.https://ieeexplore.ieee.org/document/9748232
Google Scholar
Crossref
Search ADS
 
12.
Tan
,
M.
,
Xu
,
J.
,
Liu
,
S.
,
Feng
,
J.
,
Zhang
,
H.
,
Yao
,
C.
,
Chen
,
S.
, and
et al.
,
2023
, “
Co-Packaged Optics (CPO): Status, Challenges, and Solutions
,”
Front. Optoelectron.
,
16
(
1
), pp.
1
–
40
.10.1007/s12200-022-00055-y
Google Scholar
Crossref
Search ADS
PubMed
 
13.
Grenier
,
J.
,
Brusberg
,
L.
,
Wieland
,
K.
,
Matthies
,
J.
, and
Terwilliger
,
C.
,
2023
, “
Ultrafast Laser Processing of Glass Waveguide Substrates for Multi-Fiber Connectivity in Co-Packaged Optics
,”
Adv. Opt. Technol.
,
12
, pp.
1
–
21
.10.3389/aot.2023.1244009
Google Scholar
Crossref
Search ADS
 
14.
Noriki
,
A.
, and
Amano
,
T.
,
2023
, “
Self-Aligned Optical Connector Assembly on Polymer Waveguide Integrated Package Substrate for Co-Packaged Optics
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
1892
–
1895
.10.1109/ECTC51909.2023.00324
Google Scholar
Crossref
Search ADS
 
15.
Yeary
,
L.
,
Brusberg
,
L.
,
Kim
,
C.
,
Seok
,
S.
,
Noh
,
J.
, and
Rozenvax
,
A.
,
2023
, “
Co-Packaged Optics on Glass Substrates for 102.4 Tb/s Data Center Switches
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
224
–
227
.10.1109/ECTC51909.2023.00046
Google Scholar
Crossref
Search ADS
 
16.
Gupta
,
P.
,
Bernson
,
R.
,
Nudds
,
N.
,
Collins
,
S.
,
Gradkowski
,
K.
,
Morrissey
,
P.
, and
O'Brien
,
P.
,
2023
, “
Reference Thermal Chips for 2D and 3D Co-Packaging Process Development
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
2165
–
2170
.10.1109/ECTC51909.2023.00372
Google Scholar
Crossref
Search ADS
 
17.
Bhuvanendran
,
S.
,
Gourikutty
,
N.
,
Long
,
L.
,
Wei
,
S.
,
Jong
,
M.
,
Ho
,
D.
, and
Wu
,
J.
, et al.,
2023
, “
A Heterogeneously Integrated Wafer-Level Processed Co-Packaged Optical Engine for Hyper-Scale Data Centres
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
207
–
211
.10.1109/ECTC51909.2023.00043
18.
Li
,
J.
,
Hsu
,
T.
,
Zhuan
,
M.
,
Lin
,
S.
,
Shih
,
T.
,
Kao
,
N.
, and
Eang
,
Y.
,
2023
, “
Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
228
–
232
.10.1109/ECTC51909.2023.00047
Google Scholar
Crossref
Search ADS
 
19.
McDonough
,
C.
,
Kruger
,
S.
,
Ngai
,
T.
,
Baranowski
,
S.
,
Yang
,
H.
,
Deckoff-Jones
,
S.
,
Poulton
,
C.
,
Watts
,
M.
, and
Harame
,
D.
,
2023
, “
AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
233
–
238
.10.1109/ECTC51909.2023.00048
Google Scholar
Crossref
Search ADS
 
20.
Lin, V., Shih, T., Kang, A., and Wang, Y., 2024, “Fan-Out Embedded Bridge Structure for Co-Packaged Optics Characterization and Evaluation,” Proceedings of IEEE/ECTC, Denver, CO, May 28–31, pp.
1246
–
1250
.
21.
Hsia
,
H.
,
Tai
,
S. P.
,
Liu
,
C. S.
,
Tseng
,
C. W.
,
Lu
,
S. W.
,
Wu
,
Y.
, and
Chang
,
C. C.
, et al.,
2023
, “
Integrated Optical Interconnect Systems (iOIS) for Silicon Photonics Applications in HPC
,”
Proceedings of IEEE/ECTC
, Orlando, FL, May 30–June 2, pp.
612
–
616
.10.1109/ECTC51909.2023.00108
Google Scholar
Crossref
Search ADS
 
22.
Lu
,
M.
,
Mu
,
S.
,
Cheng
,
C.
, and
Chen
,
J.
,
2022
, “
Advanced Packaging Technologies for Co-Packaged Optics
,”
Proceedings of IEEE/ECTC
, San Diego, CA, May 31–June 3, pp.
38
–
42
.10.1109/ECTC51906.2022.00014
23.
Application Chou
,
B.
,
Sawyer
,
B. M.
,
Lyu
,
G.
,
Timurdugan
,
E.
,
Minkenberg
,
C.
,
Zilkie
,
A. J.
, and
McCann
,
D.
,
2022
, “
Demonstration of Fan-Out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO)
,”
Proceedings of IEEE/ECTC
, San Diego, CA, May 31–June 3, pp.
394
–
402
.10.1109/ECTC51906.2022.00071
24.
Razdan
,
S.
,
Dobbelaere
,
P.
,
Xue
,
J.
,
Prasad
,
A.
, and
Patel
,
V.
,
2022
, “
Advanced 2.5D Packaging Technologies for Next Generation Silicon Photonics in High Performance Networking Applications
,”
Proceedings of IEEE/ECTC
, San Diego, CA, May 31–June 3, pp.
428
–
435
.10.1109/ECTC51906.2022.00075
Google Scholar
Crossref
Search ADS
 
25.
Janta-Polczynski
,
A.
, and
Robitaille
,
M.
,
2022
, “
Optical Fiber Pigtails Integration in Co-Package
,”
Proceedings of IEEE/ECTC
, San Diego, CA, May 31–June 3, pp.
410
–
421
.10.1109/ECTC51906.2022.00073
Google Scholar
Crossref
Search ADS
 
26.
Maharry
,
A.
,
Valenzuela
,
L. A.
,
Buckwalter
,
J. F.
, and
Schow
,
C. L.
,
2021
, “
A PCB Packaging Platform Enabling 100+ Gbaud Optoelectronic Device Testing
,”
Proceedings of IEEE/ECTC
, San Diego, CA, June 1–July 4, pp.
1323
–
1328
.10.1109/ECTC32696.2021.00214
Google Scholar
Crossref
Search ADS
 
27.
Nieweglowski
,
K.
,
Lorenz
,
L.
,
Bock
,
K.
,
Catuneanu
,
M.
, and
Jamshidi
,
K.
,
2020
, “
Electro-Optical Co-Integration of Chip-Components in Optical Transceivers for Optical Inter-Chip Communication
,”
Proceedings of IEEE/ECTC
, Orlando, FL, June 3–30, pp.
139
–
147
.10.1109/ECTC32862.2020.00035
Google Scholar
Crossref
Search ADS
 
28.
Lau
,
J. H.
, and
Tseng
,
T. J.
,
2022
, “
Package Structure and Optical Signal Transmitter
,” U.S. Patent No. 11,860,428.
29.
Lau
,
J. H.
, and
Tseng
,
T. J.
,
2023
, “
3D Integration of Electronic IC and Photonic IC
,” U.S. Patent application filed on July 25.
30.
Lau
,
J. H.
, and
Tseng
,
T. J.
,
2023
, “
3D Heterogeneous Integration of Electronic IC and Photonic IC
,” U.S. Patent application filed on Sept. 25.
31.
Lau
,
J. H.
, and
Tseng
,
T. J.
,
2023
, “
Low-Cost Heterogeneous Integration Packaging of Electronic IC and Photonic IC
,” U.S. Patent application filed on Nov. 6.
32.
Lau
,
J. H.
,
1995
,
Ball Grid Array Technology
,
McGraw-Hill Book Company
,
New York
.
33.
Lau
,
J. H.
,
2023
, “
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Interposers
,”
IEEE Trans. CPMT
,
13
(
1
), pp.
3
–
25
.10.1109/TCPMT.2023.3234007
34.
Lau
,
J. H.
,
Ko
,
C.
,
Lin
,
P.
,
Tseng
,
T.
,
Tain
,
R.
, and
Yang
,
H.
,
2022
, “
Package Structure and Manufacturing Method Thereof
,” U.S. Patent No. 11,410,933.
35.
Chiu
,
C.
,
Qian
,
Z.
, and
Manusharow
,
M.
,
2014
, “
Bridge Interconnect With Air Gap in Package Assembly
,” U.S. Patent No. 8,872,349.
36.
Mahajan
,
R.
,
Sankman
,
R.
,
Patel
,
N.
,
Kim
,
D.
,
Aygun
,
K.
, and
Qian
,
Z.
, Mekonnen, Y., et al.,
2016
, “
Embedded Multi-Die Interconnect Bridge (EMIB)—A High-Density, High-Bandwidth Packaging Interconnect
,”
Proceedings of IEEE/ECTC
, Las Vegas, NV, May 31–June 3, pp.
557
–
565
.10.1109/ECTC.2016.201
Google Scholar
Crossref
Search ADS
 
37.
Lau
,
J. H.
,
2022
, “
Recent Advances and Trends in Advanced Packaging
,”
IEEE Trans. CPMT
,
12
(
2
), pp.
228
–
252
.10.1109/TCPMT.2022.3144461
Copyright © 2025 by ASME
You do not currently have access to this content.