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Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
https://doi.org/10.1115/1.4002451
Published Online: September 30, 2010
View Article titled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Article titled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards
Journal Articles

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
https://doi.org/10.1115/1.1648061
Published Online: April 30, 2004
View Article titled, Research of Underfill Delamination in Flip Chip by the J -Integral Method
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Topics: Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles
Journal Articles

Characterization of Lead-Free Solders in Flip Chip Joints

S. Wiese, E. Meusel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
https://doi.org/10.1115/1.1604155
Published Online: December 15, 2003
View Article titled, Characterization of Lead-Free Solders in Flip Chip Joints
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Topics: Crack propagation, Creep, Flip-chip, Flip-chip devices, Solders, Stress, Fatigue, Temperature
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 171–174.
https://doi.org/10.1115/1.2792613
Published Online: June 1, 1998
View Article titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Journal Articles

An Empirical Crack Propagation Model and its Applications for Solder Joints

Jimmy M. Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1996, 118(2): 104–107.
https://doi.org/10.1115/1.2792128
Published Online: June 1, 1996
View Article titled, An Empirical Crack Propagation Model and its Applications for Solder Joints
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Topics: Crack propagation, Solder joints, Reliability, Creep, Fracture mechanics, Inspection, Temperature, Tin
Journal Articles

Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints

Tsung-Yu Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 163–170.
https://doi.org/10.1115/1.2905681
Published Online: September 1, 1994
View Article titled, Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints
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Topics: Failure, Fatigue, Solder joints, Creep, Fatigue life, Cycles, Density, Computers, Crack propagation, Design
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 69–75.
https://doi.org/10.1115/1.2905507
Published Online: June 1, 1994
View Article titled, Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
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Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)
Journal Articles

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

A. I. Attarwala, J. K. Tien, G. Y. Masada, G. Dody
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 109–111.
https://doi.org/10.1115/1.2906405
Published Online: June 1, 1992
View Article titled, Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
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Topics: Creep, Fatigue damage, Solder joints, Tin, Fatigue, Fracture (Materials), Solders, Crack propagation, Cracking (Materials), Cycles
Journal Articles

A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling

Boon Wong, D. E. Helling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 104–109.
https://doi.org/10.1115/1.2904349
Published Online: June 1, 1990
View Article titled, A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling
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Topics: Failure, Solder joints, Fracture (Materials), Solders, Crack propagation, Surface mount packaging, Deformation, Resistors, Tin