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Journal Articles

A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters

Liu Chu, Jiajia Shi, Eduardo Souza de Cursi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011003.
Paper No: EP-23-1089
https://doi.org/10.1115/1.4065079
Published Online: May 20, 2024
View Article titled, A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
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Topics: Ball-Grid-Array packaging, Electronic packaging, Finite element model, Resonance, Vibration, Solders
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
https://doi.org/10.1115/1.4049577
Published Online: February 19, 2021
View Article titled, Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes
Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011001.
Paper No: EP-19-1055
https://doi.org/10.1115/1.4047227
Published Online: June 4, 2020
View Article titled, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
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Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Article titled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011002.
Paper No: EP-17-1035
https://doi.org/10.1115/1.4038245
Published Online: March 2, 2018
View Article titled, Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Article titled, Modeling Thermal Microspreading Resistance in Via Arrays
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041009.
Paper No: EP-13-1070
https://doi.org/10.1115/1.4025667
Published Online: November 18, 2013
View Article titled, Experimental and Modeling Studies of Looping Process for Wire Bonding
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Topics: Wire, Materials properties, Finite element model
Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
https://doi.org/10.1115/1.4025597
Published Online: November 5, 2013
View Article titled, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods
Journal Articles

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Se-Chang Kim, Dae-Geun Cho, Tae-Gyu Kim, Se-Hun Jung, Ja-Choon Koo, Moon-Ki Kim, Jae-Boong Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041001.
Paper No: EP-13-1004
https://doi.org/10.1115/1.4024748
Published Online: August 7, 2013
View Article titled, Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules
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Topics: Finite element analysis, Finite element model, Shock (Mechanics), Impact testing, Packaging
Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
https://doi.org/10.1115/1.4007258
Published Online: October 30, 2012
View Article titled, Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives
Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
View Article titled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly
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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing
Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011009.
https://doi.org/10.1115/1.4006137
Published Online: March 21, 2012
View Article titled, Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation
Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011001.
https://doi.org/10.1115/1.4005955
Published Online: March 19, 2012
View Article titled, A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact
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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031001.
https://doi.org/10.1115/1.4004656
Published Online: September 14, 2011
View Article titled, Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics
Journal Articles

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
https://doi.org/10.1115/1.4000281
Published Online: October 29, 2009
View Article titled, Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
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Topics: Bonding, Displacement, Elastic moduli, Finite element analysis, Modeling, Sensitivity analysis, Simulation, Stress, Finite element model