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Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu

Publisher: ASME

J. Electron. Packag. September 2018, 140(3): 031007.

Paper No: EP-18-1009

https://doi.org/10.1115/1.4040298

Published Online: June 11, 2018

View Article titled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds

Journal Articles

Recent Advances and New Trends in Flip Chip Technology

John H. Lau

Publisher: ASME

J. Electron. Packag. September 2016, 138(3): 030802.

Paper No: EP-16-1052

https://doi.org/10.1115/1.4034037

Published Online: July 25, 2016

View Article titled, Recent Advances and New Trends in Flip Chip Technology

Topics: Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging

Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen

Publisher: ASME

J. Electron. Packag. September 2010, 132(3): 031008.

https://doi.org/10.1115/1.4002010

Published Online: September 9, 2010

View Article titled, Interactions Between Flip Chip Underfill and Solder Alloy

Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles

Journal Articles

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman

Publisher: ASME

J. Electron. Packag. December 2008, 130(4): 041005.

https://doi.org/10.1115/1.3010378

Published Online: November 17, 2008

View Article titled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Topics: Delamination, Flip-chip assemblies, Flow (Dynamics), Thermal shock, Fracture (Materials), Thermomechanics, Fatigue

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

Publisher: ASME

J. Electron. Packag. June 2008, 130(2): 021009.

https://doi.org/10.1115/1.2912209

Published Online: May 9, 2008

View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

Publisher: ASME

J. Electron. Packag. June 2008, 130(2): 021008.

https://doi.org/10.1115/1.2912188

Published Online: May 9, 2008

View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion

Journal Articles

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton

Publisher: ASME

J. Electron. Packag. September 2006, 128(3): 202–207.

https://doi.org/10.1115/1.2229215

Published Online: November 24, 2005

View Article titled, Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Topics: Cooling, Heating, Lead-free solders, Solders, Flip-chip assemblies

Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME

Publisher: ASME

J. Electron. Packag. June 2005, 127(2): 86–90.

https://doi.org/10.1115/1.1846062

Published Online: June 3, 2005

View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation

Journal Articles

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans

Publisher: ASME

J. Electron. Packag. September 2004, 126(3): 351–358.

https://doi.org/10.1115/1.1772416

Published Online: October 6, 2004

View Article titled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Topics: Flip-chip assemblies, Stress, Thermomechanics, Flip-chip devices, Deformation, Structural mechanics, Finite element model

Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton

Publisher: ASME

J. Electron. Packag. June 2005, 127(2): 120–126.

https://doi.org/10.1115/1.1876472

Published Online: May 18, 2004

View Article titled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability

Journal Articles

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng

Publisher: ASME

J. Electron. Packag. March 2004, 126(1): 94–99.

https://doi.org/10.1115/1.1648061

Published Online: April 30, 2004

View Article titled, Research of Underfill Delamination in Flip Chip by the J -Integral Method

Topics: Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles

Journal Articles

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Ji Eun Park, Iwona Jasiuk, Mem. ASME,, Alek Zubelewicz

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 44–52.

https://doi.org/10.1115/1.1527656

Published Online: March 14, 2003

View Article titled, Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Topics: Fracture (Materials), Fracture (Process), Particulate matter, Stress, Strips, Flip-chip assemblies

Journal Articles

The Strength of the Silicon Die in Flip-Chip Assemblies

B. Cotterell, Z. Chen, J.-B. Han, N.-X. Tan

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 114–119.

https://doi.org/10.1115/1.1535934

Published Online: March 14, 2003

View Article titled, The Strength of the Silicon Die in Flip-Chip Assemblies

Topics: Fracture (Materials), Fracture (Process), Probability, Reliability, Silicon, Stress, Grinding, Flip-chip assemblies

Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 84–92.

https://doi.org/10.1115/1.1533802

Published Online: March 14, 2003

View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion

Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu

Publisher: ASME

J. Electron. Packag. December 2002, 124(4): 397–402.

https://doi.org/10.1115/1.1510865

Published Online: December 12, 2002

View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)

Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 306–310.

https://doi.org/10.1115/1.1289998

Published Online: June 20, 2000

View Article titled, Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress

Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

B. Han, Mem. ASME, P. Kunthong

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 294–300.

https://doi.org/10.1115/1.1290000

Published Online: May 15, 2000

View Article titled, Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability

Journal Articles

Thermal Management in Direct Chip Attach Assemblies

D. F. Baldwin, J. T. Beerensson

Publisher: ASME

J. Electron. Packag. December 1999, 121(4): 222–230.

https://doi.org/10.1115/1.2793844

Published Online: December 1, 1999

View Article titled, Thermal Management in Direct Chip Attach Assemblies

Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions

Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu

Publisher: ASME

J. Electron. Packag. September 1999, 121(3): 196–201.

https://doi.org/10.1115/1.2792684

Published Online: September 1, 1999

View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Journal Articles

Random Change of Vibration Modes in Thermosonic Bonding

S.-Y. Kang, K. Chuang, Y. C. Lee

Publisher: ASME

J. Electron. Packag. September 1998, 120(3): 253–258.

https://doi.org/10.1115/1.2792630

Published Online: September 1, 1998

View Article titled, Random Change of Vibration Modes in Thermosonic Bonding

Topics: Bonding, Vibration, Friction, End effectors, Excitation, Flip-chip assemblies, Generators, Modal analysis, Process control, Resonance

Journal citation

NARROW

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Recent Advances and New Trends in Flip Chip Technology

Interactions Between Flip Chip Underfill and Solder Alloy

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

The Strength of the Silicon Die in Flip-Chip Assemblies

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Thermal Management in Direct Chip Attach Assemblies

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Random Change of Vibration Modes in Thermosonic Bonding

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