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Journal Articles

Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011004.
Paper No: EP-24-1055
https://doi.org/10.1115/1.4065667
Published Online: June 20, 2024
View Article titled, Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
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Topics: Bridges (Structures), Glass, Integrated circuits, Optics, Switches
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
View Article titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Article titled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
https://doi.org/10.1115/1.4037221
Published Online: July 27, 2017
View Article titled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules
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Topics: Glass, Manufacturing, Filters
Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021006.
Paper No: EP-15-1051
https://doi.org/10.1115/1.4033106
Published Online: April 15, 2016
View Article titled, Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)
Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Article titled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Open the PDF for Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film in another window
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Open the PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV in another window
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
https://doi.org/10.1115/1.4000363
Published Online: November 12, 2009
View Article titled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat
Journal Articles

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Jianhua Zhang, Fang Yuan, Jinsong Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041008.
https://doi.org/10.1115/1.4000361
Published Online: October 29, 2009
View Article titled, Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
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Topics: Bonding, Warping, Glass, Temperature
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Article titled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
View Article titled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu, Ting Li, Lin Hao, Dacheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 38–42.
https://doi.org/10.1115/1.1849231
Published Online: March 21, 2005
View Article titled, PCR Microchip Array Based on Polymer Bonding Technique
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Topics: Bonding, DNA, Fluorescence, Integrated circuits, Packaging, Photoresists, Polymers, Epoxy adhesives, Epoxy resins, Silicon
Journal Articles

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Hong-Seok Min, Young-Chang Joo, Oh-Sung Song
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
https://doi.org/10.1115/1.1649238
Published Online: April 30, 2004
View Article titled, Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
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Topics: Annealing, Bonding, Glass, Semiconductor wafers, Temperature, Surface roughness, Scanning probe microscopy
Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
https://doi.org/10.1115/1.1604807
Published Online: December 15, 2003
View Article titled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Article titled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension
Journal Articles

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 328–333.
https://doi.org/10.1115/1.1503064
Published Online: December 12, 2002
View Article titled, Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces
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Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Glass, Stress corrosion cracking, Water, Fatigue cracks, Durability