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Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Article titled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

Aleksander Sesek, Olga Chambers, Janez Trontelj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021005.
Paper No: EP-18-1040
https://doi.org/10.1115/1.4042804
Published Online: March 4, 2019
View Article titled, Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
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Topics: Image processing, Image segmentation, X-rays, Shapes, Soldering, Edge detection
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

A New Method to Determine Crack Shape and Size in Solder Joints

T. Reinikainen, F. W. Wulff, W. Kolbe, T. Ahrens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 266–269.
https://doi.org/10.1115/1.2792103
Published Online: December 1, 1995
View Article titled, A New Method to Determine Crack Shape and Size in Solder Joints
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Topics: Fracture (Materials), Shapes, Solder joints, Solders, Computer-aided design, Fatigue cracks, Capacitors, Ceramics, Copper, Image processing
Journal Articles

Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain

V. T. Kowalski, A. S. Voloshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 177–183.
https://doi.org/10.1115/1.2905683
Published Online: September 1, 1994
View Article titled, Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain
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Topics: Interferometry, Lasers, Welded joints, Diffraction gratings, Image processing, Manufacturing, Plates (structures), Separation (Technology), Thermal stresses, Welding
Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 286–293.
https://doi.org/10.1115/1.2905408
Published Online: September 1, 1991
View Article titled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces
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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)