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Journal Articles

Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011004.
Paper No: EP-24-1055
https://doi.org/10.1115/1.4065667
Published Online: June 20, 2024
View Article titled, Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
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Topics: Bridges (Structures), Glass, Integrated circuits, Optics, Switches
Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
https://doi.org/10.1115/1.4065649
Published Online: June 20, 2024
View Article titled, Acoustic Characterization of Integrated Circuits During Operation
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Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Article titled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
Open the PDF for Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011002.
Paper No: EP-19-1077
https://doi.org/10.1115/1.4047228
Published Online: June 4, 2020
View Article titled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
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Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
View Article titled, Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
https://doi.org/10.1115/1.4036404
Published Online: June 12, 2017
View Article titled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041003.
Paper No: EP-14-1099
https://doi.org/10.1115/1.4031523
Published Online: September 25, 2015
View Article titled, Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds
Journal Articles

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2014, 136(4): 040801.
Paper No: EP-14-1068
https://doi.org/10.1115/1.4028629
Published Online: October 15, 2014
View Article titled, Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
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Topics: Integrated circuit packaging, Manufacturing, Semiconductor wafers, Supply chains, Wire bonding, Packaging, Integrated circuits, Bonding
Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
https://doi.org/10.1115/1.4005298
Published Online: December 9, 2011
View Article titled, A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat
Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
https://doi.org/10.1115/1.4004830
Published Online: September 30, 2011
View Article titled, Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances
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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Open the PDF for Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards in another window
Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Marta Rencz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
https://doi.org/10.1115/1.3565444
Published Online: March 10, 2011
View Article titled, Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
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Topics: Cooling, Electronic packaging, Heat transfer, Integrated circuits, Microchannel flow