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Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Article titled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
https://doi.org/10.1115/1.4053121
Published Online: February 7, 2022
View Article titled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance
Journal Articles

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Lihua Liang, Yuanxiang Zhang, Yong Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
https://doi.org/10.1115/1.4004658
Published Online: September 14, 2011
View Article titled, Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
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Topics: Algorithms, Density, Electrodiffusion, Failure, Sensitivity analysis, Simulation, Solder joints, Solders, Current density, Stress
Journal Articles

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
https://doi.org/10.1115/1.4000281
Published Online: October 29, 2009
View Article titled, Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
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Topics: Bonding, Displacement, Elastic moduli, Finite element analysis, Modeling, Sensitivity analysis, Simulation, Stress, Finite element model
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
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Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
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Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions
Journal Articles

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

H. A. Jensen, A. O. Cifuentes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1998, 120(4): 391–394.
https://doi.org/10.1115/1.2792652
Published Online: December 1, 1998
View Article titled, A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations
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Topics: Electronic systems, Excitation, Sensitivity analysis, Design, Dynamic response, Electronic components, Uncertainty
Journal Articles

Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets

Eric B. Zimmerman, Gene T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 258–263.
https://doi.org/10.1115/1.2792161
Published Online: December 1, 1996
View Article titled, Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
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Topics: Modeling, Transients (Dynamics), Temperature, Computer simulation, Differential equations, Electronics, Runge-Kutta methods, Sensitivity analysis
Journal Articles

Optimal Chip Layout on a Printed Circuit Board Using Design Sensitivity Analysis of Subdomain Configuration

Seo Jin Joo, Byung Man Kwak
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 275–280.
https://doi.org/10.1115/1.2792105
Published Online: December 1, 1995
View Article titled, Optimal Chip Layout on a Printed Circuit Board Using Design Sensitivity Analysis of Subdomain Configuration
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Topics: Design sensitivity analysis, Printed circuit boards, Design, Optimization, Sensitivity analysis, Shape design, Shapes
Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 141–146.
https://doi.org/10.1115/1.2792081
Published Online: June 1, 1995
View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias
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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure
Journal Articles

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Shigekazu Kieda, Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 270–275.
https://doi.org/10.1115/1.2909328
Published Online: September 1, 1993
View Article titled, Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling
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Topics: Computer cooling, Finite element methods, Thermal analysis, Computers, Cooling, Heat, Sensitivity analysis, Temperature, Temperature distribution, Thermal properties