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Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
https://doi.org/10.1115/1.4056329
Published Online: December 9, 2022
View Article titled, Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging
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Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021002.
Paper No: EP-22-1037
https://doi.org/10.1115/1.4055024
Published Online: August 8, 2022
View Article titled, Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Article titled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
https://doi.org/10.1115/1.4053889
Published Online: March 8, 2022
View Article titled, Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability
Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
https://doi.org/10.1115/1.4051025
Published Online: August 6, 2021
View Article titled, Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy
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Topics: Alloys, Composite materials, Nanoparticles, Solders, Tin, Tensile strength
Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
https://doi.org/10.1115/1.4046341
Published Online: March 9, 2020
View Article titled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting
Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
https://doi.org/10.1115/1.4045980
Published Online: February 4, 2020
View Article titled, Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
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Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Article titled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
View Article titled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
https://doi.org/10.1115/1.4039749
Published Online: May 9, 2018
View Article titled, Gold-Tin Solder Wetting Behavior for Package Lid Seals
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Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints
Journal Articles

Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process

Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, C. J. Hou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011003.
Paper No: EP-17-1089
https://doi.org/10.1115/1.4038861
Published Online: March 2, 2018
View Article titled, Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process
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Topics: Solder joints, Tin, Solders, Nanoparticles
Journal Articles

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Joel Thambi, Andreas Schiessl, Manuela Waltz, Klaus-Dieter Lang, Ulrich Tetzlaff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
https://doi.org/10.1115/1.4035850
Published Online: June 14, 2017
View Article titled, Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys
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Topics: Alloys, Creep, Stress, Temperature, Tin, Modeling
Journal Articles

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Yan Zhu, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
https://doi.org/10.1115/1.4034819
Published Online: October 10, 2016
View Article titled, Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
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Topics: Solder joints, Solders, Tin, Diluents, Intermetallic compounds
Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041006.
Paper No: EP-16-1095
https://doi.org/10.1115/1.4034842
Published Online: October 10, 2016
View Article titled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
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Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel
Journal Articles

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Subhasis Mukherjee, Mohammed Nuhi, Abhijit Dasgupta, Mohammad Modarres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
https://doi.org/10.1115/1.4033375
Published Online: June 8, 2016
View Article titled, Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
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Topics: Creep, Solders, Tin, Constitutive equations
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Article titled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin